Network Platform Architect

Intel
United States
Workplace: HybridFull timeUSD 203,200 - 286,870 annuallyFunction: DevOps, Cloud & InfrastructureExperience: 8+ yearsEducation: bachelorsSkills: ["Cross-functional leadership","Problem-solving","Communication","Technical alignment","Architectural documentation"]

Define and architect Intel’s network platform and adapter card solutions for IPU-based NIC products. Own end-to-end platform integration and manageability/serviceability architecture across OEM variants, including sideband interfaces, data vs management plane considerations, thermal/power envelopes, and reliability/service workflows. Lead cross-functional architecture reviews connecting SoC, board, firmware/software, validation, and manufacturing to drive early requirements closure for next-generation network products.

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FursaFursa
Intel
Intel
2 months ago

Network Platform Architect

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live
Reposted: similar role first listed 1 month ago

Job Summary

Define and architect Intel’s network platform and adapter card solutions for IPU-based NIC products. Own end-to-end platform integration and manageability/serviceability architecture across OEM variants, including sideband interfaces, data vs management plane considerations, thermal/power envelopes, and reliability/service workflows. Lead cross-functional architecture reviews connecting SoC, board, firmware/software, validation, and manufacturing to drive early requirements closure for next-generation network products.
Location: United States
Workplace: Hybrid
Employment Type: Full time
Job Function: DevOps, Cloud & Infrastructure
Seniority: Mid level

Key Responsibilities

  • •Own adapter/card architecture for IPU-based NIC products, including form factor, I/O topology, feature partitioning, and platform integration requirements.
  • •Define board-level architecture for PCIe connectivity assumptions, signal strategies (retimer/redriver), clocking/reset, SPI/I2C/SMBus/USB topology, and related secure boot/update/debug hooks.
  • •Drive platform manageability interconnect and serviceability architecture across OEM variants, including sideband interfaces, MVP scoping, and data-plane vs management-plane separation.
  • •Own adapter-level thermal, power, and reliability requirements, including power targets/states, cooling assumptions, power delivery architecture requirements, and reliability/serviceability expectations.
  • •Serve as the single platform architecture voice, leading cross-functional alignment across silicon, board, FW/SW, validation, and operations to close platform-level risks early.

Pay and Benefits

Salary: USD 203,200 - 286,870 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •8+ years experience in NIC/adapter platform architecture, server platform architecture, SoC-to-board integration, or high-speed I/O platform design.
  • •Define adapter/card architectures balancing electrical, thermal, mechanical, cost, and manufacturability constraints.
  • •Strong understanding of platform manageability concepts and sideband integration constraints across OEM environments.
  • •Experience defining and closing thermal/power envelopes for add-in cards or tightly constrained platforms with thermal/mechanical engineering and validation.
  • •Bachelor’s degree in computer science, Network Engineering, or a related field (or equivalent experience).
Experience:8+ yearsNetworkingData centersOEM/ODMHardware platforms
Education:Bachelor's in Computer science, Network Engineering, or a related field
Skills:Cross-functional leadershipProblem-solvingCommunicationTechnical alignmentArchitectural documentation
Tech Stack:IPUDPUNICAdapter architectureSoCBoard designPlatform firmware/softwareOEM/ODM integrationPCIeRetimerRedriverClocking/resetSPII2CSMBusUSBSecure bootSecure updateTelemetryMonitoring

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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