AMD

3 weeks ago

AI Automation Design Packaging Lead

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Lead the development and deployment of AI-driven packaging design automation for next-generation heterogeneous integration. Drive AI/ML workflows across substrate, organic interposer, and silicon bridge methodologies, optimizing placement, auto-routing, and signal integrity. Collaborate with EDA vendors and internal teams to shape 2.5D/3D roadmaps, transition from manual to agentic/algorithmic design models, and build closed-loop optimization with simulation feedback. Present executive ROI summaries and mentor junior engineers.

Location: Austin

Workplace: Hybrid

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Sr. Manager level

Key Responsibilities

•Drive the development, deployment, and maintenance of AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
•Deploy AI/ML to optimize critical design stages including auto-routing, component placement, and signal integrity.
•Collaborate with EDA vendors and internal stakeholders to define and implement feature roadmaps for 2.5D and 3D packaging.
•Lead the transition from manual design practices to agentic and algorithmic design operational models.
•Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems and present executive ROI summaries; mentor junior engineers.

Pay and Benefits

Salary: USD 142,450 - 244,200 annually

Key Requirements

•Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
•Proven automation development experience using Python, Tcl, SKILL, or C++.
•Experience applying AI/ML frameworks (e.g., PyTorch, TensorFlow) to engineering or design problems.
•Familiarity with advanced packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
•Familiarity with design verification flows (DRC/LVS) and electrical extraction concepts.

Experience:AI/MLEDAAdvanced packaging

Education:Bachelor's in Electrical Engineering, Computer Engineering, Computer Science, or related field

Skills:LeadershipCross-functional collaborationExecutive presentationTechnical innovationMentorship

Tech Stack:PythonTclSKILLC++PyTorchTensorFlowCadence APD/SIPSiemens XpeditionSynopsys 3DICCompilerEDADRCLVS2.5D3DChipletsFan-OutHybrid Bonding

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD