Thin Films Module Development Engineering

Intel
Oregon
Workplace: OnsiteFull timeUSD 133,800 - 255,200 annuallyFunction: Product ManagementExperience: 5+ yearsEducation: bachelorsSkills: ["Collaboration","Technical leadership","Problem-solving","Process improvement","Data-driven decision making"]

Drive development and optimization of advanced manufacturing processes for Intel’s semiconductor and advanced packaging technologies. Work within the Advanced Packaging Technology Development organization to design and enable high-volume manufacturing, run feasibility studies and simulations, and translate technology roadmaps into scalable process improvements. Collaborate with equipment and materials suppliers and cross-functional teams to improve yield, stability, efficiency, and output using statistical process control and data analytics.

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Intel
Intel
1 day ago

Thin Films Module Development Engineering

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Job Summary

Drive development and optimization of advanced manufacturing processes for Intel’s semiconductor and advanced packaging technologies. Work within the Advanced Packaging Technology Development organization to design and enable high-volume manufacturing, run feasibility studies and simulations, and translate technology roadmaps into scalable process improvements. Collaborate with equipment and materials suppliers and cross-functional teams to improve yield, stability, efficiency, and output using statistical process control and data analytics.
Location: Oregon
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Lead design and development of advanced manufacturing processes, including materials selection, parameter optimization, equipment metrology, and system design.
  • •Drive technology development and enablement for high-volume manufacturing and future technologies.
  • •Conduct feasibility studies and simulations to meet device specifications.
  • •Develop and execute technology roadmaps for future manufacturing needs and industry standards.
  • •Collaborate with equipment/material suppliers and cross-functional teams to align process integration and deliverables, optimizing efficiency and output using statistical process control and analytics.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree in a STEM field (Materials Science, Mechanical, Chemical, Electrical, Chemistry, Physics, or related) with 5+ years of relevant experience.
  • •Alternative: Master’s degree with 3+ years of relevant experience in the same fields.
  • •Alternative: PhD with 1+ years of relevant experience in the same fields.
  • •Proven manufacturing process development with statistical process control and/or data analytics.
  • •Experience with wafer-level assembly/semiconductor processing or advanced packaging, including films processing (CVD/PECVD, thermal/PE ALD, PVD).
Experience:5+ yearsSemiconductorsAdvanced packagingWafer-level assemblyManufacturing process development
Education:Bachelor's in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline
Skills:CollaborationTechnical leadershipProblem-solvingProcess improvementData-driven decision making
Tech Stack:CVDPECVDALDPVDThermalStatistical process controlData analyticsSimulations

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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