Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringSkills: ["Leadership","Problem-solving","Root-cause analysis","Collaboration","Communication"]

Drive package and HBM product engineering activities within Micron’s HBM Systems/Product Engineering team. Own ASM and HBM cube yield improvements, cumulative yield and quality initiatives, and root-cause analysis for packaging qualification and RMA issues using EFA/PFA. Support backend process conversions and HVM with cross-functional partners, mentor team members, and collaborate globally to deliver timely, KPI-focused improvements across quality, cost, cycle time, and scale.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live

Job Summary

Drive package and HBM product engineering activities within Micron’s HBM Systems/Product Engineering team. Own ASM and HBM cube yield improvements, cumulative yield and quality initiatives, and root-cause analysis for packaging qualification and RMA issues using EFA/PFA. Support backend process conversions and HVM with cross-functional partners, mentor team members, and collaborate globally to deliver timely, KPI-focused improvements across quality, cost, cycle time, and scale.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Own assembly and HBM cube yield improvement efforts, including coverage improvements to reduce inline fallout and improve Time 0 and Field DPM.
  • •Lead cumulative yield and quality improvement initiatives with cross-functional teams to deliver measurable organizational benefits.
  • •Debug and identify root causes for packaging qualification and RMA packaging issues using electric failure analysis (EFA) and physical failure analysis (PFA), driving resolutions.
  • •Partner with FAB and packaging/process development teams to establish robust process conversions and support backend conversion and HVM for yield, DPM, and overall HBM product performance.
  • •Mentor and develop team members while collaborating with global engineering and quality/reliability teams to execute projects and make risk-analysis and prioritization decisions.

Key Requirements

  • •Bachelors/Masters in Electrical/Electronic/Mechanical Engineering with 5 years of relevant experience.
  • •Strong leadership and technical problem-solving skills, including root-cause understanding and solution space analysis via in-depth circuit analysis.
  • •Good knowledge of statistics, data analysis tools, and scripting.
  • •Demonstrated ability to collaborate across teams to solve complex business and engineering problems.
  • •Excellent communication and presentation skills with a people-leadership focus and accountability.
  • •Work on-site in Singapore with international travel to Taiwan, US, Japan.
Experience:ManufacturingSemiconductorsMemoryProduct engineeringYield improvement
Education:
Skills:LeadershipProblem-solvingRoot-cause analysisCollaborationCommunication
Tech Stack:ScriptingStatisticsData analysis toolsAI/ML models

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn