Module Process Engineer V

Applied Materials
United States
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringSkills: ["Communication","Collaboration","Problem-solving","Leadership","Presentation"]

Lead module process integration engineering to explore and build novel devices and modules across semiconductor and specialty technology segments. Drive end-to-end technology development, including process assumptions, ground rules, test site coordination, wafer processing logistics, characterization, and process debug. Conceive, design, execute, and analyze experiments to prove viability and scalability, manage project plans and multi-party collaborations, and communicate status and risks to internal teams and external customers.

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Applied Materials
Applied Materials
1 week ago

Module Process Engineer V

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Lead module process integration engineering to explore and build novel devices and modules across semiconductor and specialty technology segments. Drive end-to-end technology development, including process assumptions, ground rules, test site coordination, wafer processing logistics, characterization, and process debug. Conceive, design, execute, and analyze experiments to prove viability and scalability, manage project plans and multi-party collaborations, and communicate status and risks to internal teams and external customers.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Director level

Key Responsibilities

  • •Conceive, design, execute, and analyze experiments to demonstrate viability and scalability of proof-of-concept devices.
  • •Identify key metrics, prepare project plans, and drive multi-party collaborations from conception to implementation.
  • •Participate on multifunctional design teams and provide technical input to achieve project goals.
  • •Communicate and report project status in a clear, organized way tailored to peers, management, leadership, and clients.
  • •Identify and resolve potential project complications by developing solutions for resolution.
Travel: Low travel

Pay and Benefits

Equity and Bonus:Equity

Key Requirements

  • •Demonstrated experience integrating integrated devices across FEOL & BEOL processing and wafer-level packaging.
  • •End-to-end technology development experience, including process assumptions, ground rule generation, test site coordination, scheduling, setup/installation, route pipe cleaning, wafer processing logistics, testing/characterization, and process debug.
  • •Experience characterizing physical and electrical properties of materials using measurement techniques.
  • •Working knowledge of semiconductor devices such as diodes, transistors, MOS, and MIM.
  • •Understanding of the relationship between device design, material composition, and functional behavior.
Experience:SemiconductorWafer processingWafer level packagingProcess integrationTechnology development
Skills:CommunicationCollaborationProblem-solvingLeadershipPresentation

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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