Senior Engineer / Principal Engineer / Member of Technical Staff, Analog / Mixed-signal Design Architect, Next-generation HBM Architecture

Micron Technology
California
Workplace: OnsiteFull timeUSD 177,000 - 309,000 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: mastersSkills: []

Design, simulate, analyze, and optimize the architecture of 3D-stacked high-performance memory for emerging AI systems. You’ll work on analog and mixed-signal circuit design, power delivery architecture, and on-/off-chip interface specifications, including timing, area, power, and complexity tradeoffs. Collaborate with peer architecture and design teams on thermal management and future-generation pathfinding, while maintaining clear architecture documentation.

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FursaFursa
Micron Technology
Micron Technology
3 weeks ago

Senior Engineer / Principal Engineer / Member of Technical Staff, Analog / Mixed-signal Design Architect, Next-generation HBM Architecture

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Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live

Job Summary

Design, simulate, analyze, and optimize the architecture of 3D-stacked high-performance memory for emerging AI systems. You’ll work on analog and mixed-signal circuit design, power delivery architecture, and on-/off-chip interface specifications, including timing, area, power, and complexity tradeoffs. Collaborate with peer architecture and design teams on thermal management and future-generation pathfinding, while maintaining clear architecture documentation.
Location: California
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Design, optimize, and simulate critical analog and/or mixed-signal circuits.
  • •Architect and design power delivery for high-performance stacked memories.
  • •Analyze, specify, and prototype on-/off-chip interfaces.
  • •Perform timing, area, power, and complexity analysis for high-performance, low-power circuits.
  • •Define architectures for improved thermal management and maintain clear architecture documentation.

Pay and Benefits

Salary: USD 177,000 - 309,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVisionPaid Leave

Key Requirements

  • •Experience with analog and/or mixed-signal design, including simulation and floorplanning.
  • •Experience with transistor-level simulation (e.g., FineSim, HSPICE) including corner analysis.
  • •Ability to analyze architecture tradeoffs and develop specifications based on findings.
  • •Experience with power delivery analysis, tradeoffs, constraints, and challenges.
  • •5+ years delivering mixed-signal circuit designs, 3D-stacked memory or logic designs, or complex packaging architectures.
Experience:5+ years3D-stacked memoryHBMDRAM
Education:Master's in Computer Science, Computer Engineering, Electrical Engineering, or equivalent experience
Tech Stack:FineSimHSPICEPythonPerlVerilogDRAMHBM3D-stacked

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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