College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging)

Applied Materials
Singapore
Workplace: OnsiteInternshipFunction: Communications, PR & CommunitySkills: ["Problem-solving","Analytical thinking","Root cause analysis","Data analysis","Creative problem-solving"]

Support engineers in optimizing and developing physical vapor deposition (PVD) processes used for hybrid bonding in SOIC (advanced packaging). You’ll collect and analyze experimental data, characterize moderately complex hardware systems within safety guidelines, and help troubleshoot issues using root cause analysis. The role also builds experience with start-of-art semiconductor technologies and structured learning guided by engineers, working with data and reporting for review.

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Applied Materials
Applied Materials
1 week ago

College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Support engineers in optimizing and developing physical vapor deposition (PVD) processes used for hybrid bonding in SOIC (advanced packaging). You’ll collect and analyze experimental data, characterize moderately complex hardware systems within safety guidelines, and help troubleshoot issues using root cause analysis. The role also builds experience with start-of-art semiconductor technologies and structured learning guided by engineers, working with data and reporting for review.
Location: Singapore
Workplace: Onsite
Employment Type: Internship
Job Function: Communications, PR & Community

Key Responsibilities

  • •Optimize PVD processes and measure metal film properties; organize data and reports for engineer review.
  • •Characterize moderately difficult PVD hardware systems and collect results within safety guidelines.
  • •Troubleshoot moderately complex process issues with engineer guidance.
  • •Perform root cause analysis and help resolve moderately difficult process engineering problems.
  • •Participate in innovation cycles for new products and engage with semiconductor technology problem-solving.

Key Requirements

  • •With engineer’s guidance, perform, collect data, and analyze unusually complex experiments to develop PVD products.
  • •Analyze PVD process performance and optimize processes to measure metal film properties and organize data/reports for review.
  • •Perform hardware characterization on moderately difficult systems within safety guidelines.
  • •Involve in troubleshooting moderately complex problems and perform root cause analysis to resolve process engineering issues.
  • •Ability to think constructively, solve problems creatively, and participate in innovation cycles for new products.
Skills:Problem-solvingAnalytical thinkingRoot cause analysisData analysisCreative problem-solving
Tech Stack:PVDPhysical Vapor DepositionRoot Cause AnalysisAutoCADANSYSChemical Vapor Deposition

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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Glassdoor: 3.9
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