High Bandwidth Memory Quality Engineer

Micron Technology
Boise, Idaho
Workplace: OnsiteFull timeFunction: QA, Test & Release EngineeringEducation: bachelorsSkills: []

Define and execute qualification requirements for high performance DRAM (HBM), including failure-rate understanding, risk assessments, and data review to certify qualification readiness. Own reliability methodology, metrics, and quality requirements, driving deviations and root-cause/CA/PA actions with manufacturing and engineering teams. Support internal release decisions, communicate violations and corrective actions, data-mine inline test results, and provide technical support to customer support teams.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

High Bandwidth Memory Quality Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 19 hours agoStatus: Live

Job Summary

Define and execute qualification requirements for high performance DRAM (HBM), including failure-rate understanding, risk assessments, and data review to certify qualification readiness. Own reliability methodology, metrics, and quality requirements, driving deviations and root-cause/CA/PA actions with manufacturing and engineering teams. Support internal release decisions, communicate violations and corrective actions, data-mine inline test results, and provide technical support to customer support teams.
Location: Boise, Idaho
Workplace: Onsite
Employment Type: Full time
Job Function: QA, Test & Release Engineering

Key Responsibilities

  • •Define high performance DRAM (HBM) qualification requirements and assess failures within qualification scope.
  • •Perform risk assessments at decision points throughout the qualification cycle.
  • •Review qualification data to confirm requirements are met and issue internal product release notifications.
  • •Develop reliability methodology, monitors, metrics, and specifications; establish reliability targets and standards with engineering teams.
  • •Data-mine and correlate inline test data, perform root cause analysis, drive corrective actions, and communicate violations and corrective actions to release/acceptance criteria.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Bachelor’s degree in Electrical Engineering or related field
  • •Experience with DRAM operation and DRAM qualification
  • •Knowledge of Complementary Metal Oxide Semiconductor (CMOS) fabrication processes
  • •Understanding of semiconductor device physics and CMOS/digital circuits
  • •Experience with DFII/Cadence or Verilog, plus UNIX and JMP
Experience:Semiconductors
Education:Bachelor's in Electrical Engineering
Tech Stack:HBMDRAMCMOSDFIICadenceVerilogUNIXJMPDPMBICCA/PA

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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