Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 6-10 yearsEducation: mastersSkills: ["Leadership","Problem-solving","Mentoring","Cross-functional collaboration","Technical leadership"]

Lead next-generation NAND Dry Etch process development for critical modules, managing dry etch chambers and driving the process roadmap to hit program and yield targets. Collaborate with process integration and related areas (wet etch, CVD, diffusion, metals, lithography, CMP) to solve complex structural problems, present technology roadmaps, and build mitigation plans for future issues. Mentor engineers, provide updates to upper management, and contribute to technical leadership initiatives.

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Micron Technology
Micron Technology
3 months ago

Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

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Job Summary

Lead next-generation NAND Dry Etch process development for critical modules, managing dry etch chambers and driving the process roadmap to hit program and yield targets. Collaborate with process integration and related areas (wet etch, CVD, diffusion, metals, lithography, CMP) to solve complex structural problems, present technology roadmaps, and build mitigation plans for future issues. Mentor engineers, provide updates to upper management, and contribute to technical leadership initiatives.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead innovation in dry etch technology and advance essential modules for next-generation NAND.
  • •Develop and innovate dry etch processes to meet structural and electrical specifications while understanding parameter-to-outcome relationships.
  • •Collaborate with hardware teams to develop the equipment roadmap for current and upcoming NAND generations.
  • •Collaborate with cross-functional teams to solve complex structural problems; present process and technology roadmaps for future nodes.
  • •Mentor less experienced engineers, contribute to the Technical Leadership Program, and provide critical updates to upper management on project status and impacts.

Key Requirements

  • •6-10 years’ experience in dry etch process development in R&D moving into manufacturing.
  • •4-5 years of applicable NAND, DRAM, or logic module development with cross-functional projects and deliveries.
  • •Knowledge of plasma physics and plasma chemistry, including transport or surface phenomena.
  • •Expertise in statistical process control and analysis, and solving scalability challenges in deep high aspect ratio silicon/dielectric etches.
  • •Masters/PhD or equivalent experience in chemical/mechanical/electrical/material science/physics/semiconductor engineering or related fields (with at least 6 years pertinent experience).
Experience:6-10 yearsR&DManufacturingSemiconductorsNANDDRAMLogicPlasma processingDry etch
Education:Master's in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering, or related fields
Skills:LeadershipProblem-solvingMentoringCross-functional collaborationTechnical leadership
Tech Stack:Dry EtchPlasma physicsPlasma chemistryRF sourcesStatistical process controlSASJMPPythonAIMS OfficeCVDDiffusionMetalsLithographyCMPWet Etch

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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