PDE PIE (Package Integration Engineering) Senior Engineer/Engineer

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 8+ yearsEducation: bachelorsSkills: ["Cross-functional collaboration","Data analysis","Statistical analysis","Data interpretation","Data-driven decision-making"]

Lead and manage new product introduction (NPI) activities as a Product Owner, driving phase gate reviews and first-pass qualification for package/assembly transfer from NPN to high-volume manufacturing. Coordinate cross-functional teams to ramp products from NPI through EOL, support engineering hot lots and qualification, and monitor yield trends and reliability via data-driven analysis (including JMP) to meet handover criteria and quality targets.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

PDE PIE (Package Integration Engineering) Senior Engineer/Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Lead and manage new product introduction (NPI) activities as a Product Owner, driving phase gate reviews and first-pass qualification for package/assembly transfer from NPN to high-volume manufacturing. Coordinate cross-functional teams to ramp products from NPI through EOL, support engineering hot lots and qualification, and monitor yield trends and reliability via data-driven analysis (including JMP) to meet handover criteria and quality targets.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead and manage NPI activities as a Product Owner, driving NPI phase gate reviews.
  • •Coordinate new product start-up to achieve first-pass qualification and communicate start-up datelines and customer requirements.
  • •Work with process/equipment/manufacturing/planning owners to bring new product and package into volume production.
  • •Provide timely support for first silicon, engineering samples, and qualification samples, including engineering hot lots cycle time per schedule.
  • •Own the product life cycle (NPI to EOL), monitoring yield trends and initiating early attention based on QDR and reliability data.

Key Requirements

  • •Masters or Bachelor's degree in Engineering (Mechanical, Material, Chemical).
  • •Min 8 years experience in an MNC semiconductor environment for mobile and automotive business.
  • •Strong packaging knowledge in backend engineering process or package development.
  • •Good technical knowledge in component test and/or module manufacturing process.
  • •Proficient in JMP analysis and strong data/statistical analysis for data interpretation and data-driven decisions.
Experience:8+ yearsSemiconductorsMobileAutomotive
Education:Bachelor's in Engineering (Mechanical, Material, Chemical)
Skills:Cross-functional collaborationData analysisStatistical analysisData interpretationData-driven decision-making
Tech Stack:JMPAI toolsCopilot

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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