Advanced Technology Japan Engineer, WoW Bonding

Micron Technology
Japan
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringSkills: ["Technical communication","Process optimization","Problem-solving","Cross-functional collaboration"]

Own Wafer Bonding process development and optimization in Micron’s ATE (Advanced Technology Engineering) organization. Evaluate and deploy next-generation equipment, stabilize processes, and drive quality, yield, cost, and productivity improvements. Apply DOE, SPC, FMEA, and 8D methodologies for reliable operations and risk reduction, while collaborating with R&D, other sites, and material suppliers to solve technical challenges and support ramp to mass production.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
2 months ago

Advanced Technology Japan Engineer, WoW Bonding

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Own Wafer Bonding process development and optimization in Micron’s ATE (Advanced Technology Engineering) organization. Evaluate and deploy next-generation equipment, stabilize processes, and drive quality, yield, cost, and productivity improvements. Apply DOE, SPC, FMEA, and 8D methodologies for reliable operations and risk reduction, while collaborating with R&D, other sites, and material suppliers to solve technical challenges and support ramp to mass production.
Location: Japan
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Develop and optimize Wafer Bonding processes, including integrated optimization of Wafer Bonding, Si Grinding, and Bevel Trimming
  • •Evaluate, install, and upgrade equipment; set up new tools, perform performance evaluations, and stabilize processes
  • •Conduct technical discussions with equipment vendors and propose specification improvements
  • •Drive quality and yield improvement using SPC metrics, abnormality analysis, and preventive measures
  • •Lead technology development projects for next-generation technology transition to mass production, collaborating with global teams and material suppliers

Key Requirements

  • •Hands-on experience with Wafer Bonding, Si Grinding, and Bevel Trimming
  • •In-depth knowledge of semiconductor packaging technologies
  • •Practical experience applying quality improvement methodologies such as DOE, SPC, and FMEA
  • •Ability to communicate technical information effectively in English with global teams
  • •Proficiency in Microsoft Office (Excel, Word, PowerPoint)
Experience:Semiconductor packaging
Skills:Technical communicationProcess optimizationProblem-solvingCross-functional collaboration
Languages:EnglishJapanese
Tech Stack:Wafer BondingSi GrindingBevel TrimmingDOESPCFMEA8DMicrosoft ExcelMicrosoft WordMicrosoft PowerPointLabVIEWFPGAPythonMATLABCMP3D integrationChemical vapor depositionPVDAbnormality analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn