R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

Broadcom
Singapore
Workplace: OnsiteFull timeFunction: Research & Scientific (R&D)Education: mastersSkills: ["Signal integrity","Power integrity","Cadence APD","Flip-chip","MCM","2.5D"]

Develop and optimize advanced packaging solutions for cutting-edge silicon nodes (5nm, 3nm, 2nm and beyond). Lead cross-functional design with IC/system/thermal teams, ensure CPI/SI/PI and thermal requirements, and drive packaging processes from concept to high-volume manufacturing while integrating new materials and technologies.

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Broadcom
Broadcom
5 months ago

R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 days agoStatus: Live

Job Summary

Develop and optimize advanced packaging solutions for cutting-edge silicon nodes (5nm, 3nm, 2nm and beyond). Lead cross-functional design with IC/system/thermal teams, ensure CPI/SI/PI and thermal requirements, and drive packaging processes from concept to high-volume manufacturing while integrating new materials and technologies.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Sr. Manager level

Key Responsibilities

  • •Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages that meet CPI, SI/PI and thermal requirements for advanced silicon nodes
  • •Manage IC packaging activity from concept through development, qualification and high-volume production
  • •Define assembly BOM, processes, and troubleshoot packaging issues on new advanced technology
  • •Implement, refine, and productize newly developed technologies into high-volume manufacturing (HVM)
  • •Create package design documentation and assembly instructions, and collaborate with QA, customers, suppliers, and other operations groups to support NPI bring-up and production ramp

Key Requirements

  • •Education: BS/MS/PhD in STEM/Material Science/Electrical/Mechanical Engineering
  • •Experience: BS + 8 years, MS + 6 years, or PhD + 3 years
  • •Deep understanding of signal integrity and power integrity concepts (impedance, s-parameters, etc.)
  • •Strong expertise with Cadence APD for custom substrate design
  • •Hands-on experience with advanced assembly processes for flip-chip, MCM packages, and 2.5D
Experience:SemiconductorIC packagingAdvanced substrates
Education:Master's
Skills:Signal integrityPower integrityCadence APDFlip-chipMCM2.5D
Languages:English
Tech Stack:Cadence APDFlip-chip2.5DMCMCPI

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn