Staff HIG ESD and Latch-up Engineer- HBM - TPG
United States
Workplace: OnsiteFull timeUSD 181,000 - 308,000 annuallyFunction: Software EngineeringEducation: mastersSkills: ["Collaboration","Problem-solving","Mentoring"]Own chip-level and IP-level ESD and latch-up protection strategies for HBM DRAM, including base die, I/O, TSVs, and die-to-die interfaces. Define ESD requirements and sign-off criteria aligned to JEDEC/ESDA standards, enable safe protection circuits and layout practices, and lead silicon validation with failure analysis and correlation to pre-silicon assumptions. Serve as the technical interface with foundries and partner cross-functionally to improve reliability at scale.
Loading
Loading job details...
Preparing the role view and application actions.

