Dry Etch Staff/Principal Engineer - Advanced NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: mastersSkills: ["Leadership","Problem-solving","Cross-functional collaboration","Project leadership","Mentorship"]

Drive Next Generation NAND Dry Etch process R&D by leading unit process and critical module development for structural and electrical specifications. Develop and innovate dry etch processes, collaborate with cross-functional process areas (e.g., wet etch, CVD, diffusion, metals, lithography, CMP), and own the dry etch process roadmap to meet program and yield goals. Present technology roadmaps, solve scaling challenges for high aspect ratio etches, and mentor peers while providing updates to upper management.

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Micron Technology
Micron Technology
7 months ago

Dry Etch Staff/Principal Engineer - Advanced NAND

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Last checked: 6 hours agoStatus: Live

Job Summary

Drive Next Generation NAND Dry Etch process R&D by leading unit process and critical module development for structural and electrical specifications. Develop and innovate dry etch processes, collaborate with cross-functional process areas (e.g., wet etch, CVD, diffusion, metals, lithography, CMP), and own the dry etch process roadmap to meet program and yield goals. Present technology roadmaps, solve scaling challenges for high aspect ratio etches, and mentor peers while providing updates to upper management.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead Dry Etch unit process and critical module development for Advanced NAND.
  • •Develop and innovate dry etch processes to meet structural and electrical specifications.
  • •Collaborate and lead cross-functional teams to solve complex structural problems and scalability issues for deep high aspect ratio silicon/dielectric etches.
  • •Own and drive the dry etch process roadmap to meet program and yield goals, including state-of-the-art dry etch chamber ownership.
  • •Be a resource and mentor for dry etch peers; provide critical updates to upper management on project status and impacts.

Key Requirements

  • •3-10 years of dry etch process development experience in R&D transferring to manufacturing.
  • •2-3 years of relevant NAND, DRAM, or Logic module development experience, including cross-functional teams, projects, and deliveries.
  • •Knowledge of plasma physics/plasma chemistry/transport/surface phenomena from experience and/or coursework.
  • •Experience with dry etch reactors and plasma sources (e.g., RF sources/chemistries) plus statistical process control and analysis.
  • •Masters/PhD in relevant fields (e.g., chemical/mechanical/electrical/material science/physics/semiconductor engineering) with 4-10 years relevant experience OR Bachelors with 7-12 years relevant experience.
Experience:Research and developmentManufacturing transferSemiconductorNANDDRAMLogic modules
Education:Master's in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors
Skills:LeadershipProblem-solvingCross-functional collaborationProject leadershipMentorship
Tech Stack:Dry EtchPlasma physicsPlasma chemistryPlasma transportSurface phenomenaRF sourcesStatistical process control (SPC)Data sciencePython codingAI codersMS OfficeSASJmP

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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