Process Engineer Intern

Applied Materials
Singapore
Workplace: OnsiteInternshipFunction: Industrial, Process & Manufacturing EngineeringSkills: ["Problem-solving","Analytical skills","Communication","Collaboration","Independent working"]

Support development, characterization, and optimization of thin film deposition processes for advanced semiconductor packaging. You’ll design and execute process engineering experiments, run and analyze wafer processing results, and characterize film properties such as thickness, uniformity, refractive index, stress, composition, and roughness. Apply statistical methods and data visualization to find trends, troubleshoot process/equipment issues, document work, and present findings to engineering leadership while collaborating cross-functionally.

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Applied Materials
Applied Materials
2 days ago

Process Engineer Intern

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Last checked: 31 minutes agoStatus: Live

Job Summary

Support development, characterization, and optimization of thin film deposition processes for advanced semiconductor packaging. You’ll design and execute process engineering experiments, run and analyze wafer processing results, and characterize film properties such as thickness, uniformity, refractive index, stress, composition, and roughness. Apply statistical methods and data visualization to find trends, troubleshoot process/equipment issues, document work, and present findings to engineering leadership while collaborating cross-functionally.
Location: Singapore
Workplace: Onsite
Employment Type: Internship
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Intern level

Key Responsibilities

  • •Design and execute process engineering experiments in collaboration with engineers.
  • •Develop and optimize thin film deposition processes (e.g., CVD, PECVD, PEALD) and run wafer processing according to procedures.
  • •Collect and analyze process and metrology data; characterize film properties (thickness, uniformity, refractive index, stress, composition, surface roughness, electrical properties).
  • •Use statistical methods and data visualization to identify trends and correlations.
  • •Troubleshoot process/equipment issues, support root cause analysis, maintain engineering logs/records, and present technical reports and updates to leadership.

Pay and Benefits

Perks:Learning BudgetTravel Allowance

Key Requirements

  • •Knowledge of semiconductor manufacturing processes.
  • •Basic understanding of thin film deposition, plasma processing, or surface science.
  • •Experience with experimental design and data analysis.
  • •Strong problem-solving and analytical skills.
  • •Effective verbal and written communication, and ability to work independently and in a team environment.
Experience:Semiconductor manufacturingSemiconductor packagingThin film depositionPlasma processingSurface science
Skills:Problem-solvingAnalytical skillsCommunicationCollaborationIndependent working
Tech Stack:CVDPECVDPEALDThin film depositionPlasma processingSurface scienceMetrologyStatistical methodsData visualizationDOERoot cause analysis

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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