Applied Materials

4 days ago

EPG Manufacturing Engineer II - (E2)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 20 hours agoStatus: Live

Job Summary

Support EPG 200mm manufacturing for semiconductor equipment by applying deep technical knowledge to solve complex issues and improve design reliability. Partner with cross-functional teams to ramp up build, integration, and testing module capabilities, using manufacturing drawings and 3D modeling principles to reduce cost and improve quality. Establish time standards, tooling/process needs, perform PFMEA and root-cause corrective actions, and maintain manufacturing/material specifications.

Location: Taiwan

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Apply EPG 200mm technical knowledge to solve complex manufacturing challenges and drive design improvements for product reliability.
•Partner with cross-functional teams to ramp up manufacturing capabilities for building, integration, and testing modules and establish robust manufacturing processes.
•Use manufacturing drawings and 3D modeling principles (DFx/Solid works/Pro-E/AutoCAD/Inventor) to estimate and reduce costs and improve product quality.
•Determine time standards and recommend tooling and process requirements.
•Perform root-cause analysis and corrective actions for assembly or system testing issues, including PFMEA and reporting; maintain manufacturing/material specifications.

Travel: Medium travel

Pay and Benefits

Perks:Travel AllowanceEmployee Assistance

Key Requirements

•Bachelor’s degree.
•2-4 years of engineering experience in the semiconductor industry.
•Technical knowledge and experience of EPG 200mm product and structure.
•Strong ability to read manufacturing drawings and use 3D modeling/design tools (DFx/Solid works/Pro-E/AutoCAD/Inventor).
•Experience with process analysis and corrective actions, including Process Failure Mode & Effects Analysis (PFMEA).

Experience:2-4 yearsSemiconductor industryManufacturing engineering

Education:Bachelor's

Skills:Interpersonal skillsProblem-solvingCommunication

Tech Stack:Microsoft OfficeSAPEngineering Change OrderDFxSolidWorksPro-EAutoCADInventorMDPETCH3D modeling

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

4 days ago

EPG Manufacturing Engineer II - (E2)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 20 hours agoStatus: Live

Job Summary

Location: Taiwan

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Apply EPG 200mm technical knowledge to solve complex manufacturing challenges and drive design improvements for product reliability.
•Partner with cross-functional teams to ramp up manufacturing capabilities for building, integration, and testing modules and establish robust manufacturing processes.
•Use manufacturing drawings and 3D modeling principles (DFx/Solid works/Pro-E/AutoCAD/Inventor) to estimate and reduce costs and improve product quality.
•Determine time standards and recommend tooling and process requirements.
•Perform root-cause analysis and corrective actions for assembly or system testing issues, including PFMEA and reporting; maintain manufacturing/material specifications.

Travel: Medium travel

Pay and Benefits

Perks:Travel AllowanceEmployee Assistance

Key Requirements

•Bachelor’s degree.
•2-4 years of engineering experience in the semiconductor industry.
•Technical knowledge and experience of EPG 200mm product and structure.
•Strong ability to read manufacturing drawings and use 3D modeling/design tools (DFx/Solid works/Pro-E/AutoCAD/Inventor).
•Experience with process analysis and corrective actions, including Process Failure Mode & Effects Analysis (PFMEA).

Experience:2-4 yearsSemiconductor industryManufacturing engineering

Education:Bachelor's

Skills:Interpersonal skillsProblem-solvingCommunication

Tech Stack:Microsoft OfficeSAPEngineering Change OrderDFxSolidWorksPro-EAutoCADInventorMDPETCH3D modeling

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor