EPG Manufacturing Engineer II - (E2)

Applied Materials
Taiwan
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 2-4 yearsEducation: bachelorsSkills: ["Interpersonal skills","Problem-solving","Communication"]

Support EPG 200mm manufacturing for semiconductor equipment by applying deep technical knowledge to solve complex issues and improve design reliability. Partner with cross-functional teams to ramp up build, integration, and testing module capabilities, using manufacturing drawings and 3D modeling principles to reduce cost and improve quality. Establish time standards, tooling/process needs, perform PFMEA and root-cause corrective actions, and maintain manufacturing/material specifications.

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Applied Materials
Applied Materials
1 month ago

EPG Manufacturing Engineer II - (E2)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Support EPG 200mm manufacturing for semiconductor equipment by applying deep technical knowledge to solve complex issues and improve design reliability. Partner with cross-functional teams to ramp up build, integration, and testing module capabilities, using manufacturing drawings and 3D modeling principles to reduce cost and improve quality. Establish time standards, tooling/process needs, perform PFMEA and root-cause corrective actions, and maintain manufacturing/material specifications.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Apply EPG 200mm technical knowledge to solve complex manufacturing challenges and drive design improvements for product reliability.
  • •Partner with cross-functional teams to ramp up manufacturing capabilities for building, integration, and testing modules and establish robust manufacturing processes.
  • •Use manufacturing drawings and 3D modeling principles (DFx/Solid works/Pro-E/AutoCAD/Inventor) to estimate and reduce costs and improve product quality.
  • •Determine time standards and recommend tooling and process requirements.
  • •Perform root-cause analysis and corrective actions for assembly or system testing issues, including PFMEA and reporting; maintain manufacturing/material specifications.
Travel: Medium travel

Pay and Benefits

Perks:Travel AllowanceEmployee Assistance

Key Requirements

  • •Bachelor’s degree.
  • •2-4 years of engineering experience in the semiconductor industry.
  • •Technical knowledge and experience of EPG 200mm product and structure.
  • •Strong ability to read manufacturing drawings and use 3D modeling/design tools (DFx/Solid works/Pro-E/AutoCAD/Inventor).
  • •Experience with process analysis and corrective actions, including Process Failure Mode & Effects Analysis (PFMEA).
Experience:2-4 yearsSemiconductor industryManufacturing engineering
Education:Bachelor's
Skills:Interpersonal skillsProblem-solvingCommunication
Tech Stack:Microsoft OfficeSAPEngineering Change OrderDFxSolidWorksPro-EAutoCADInventorMDPETCH3D modeling

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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