Principal Mechanical Engineer

AMD
San Jose
Workplace: OnsiteFull timeFunction: Field Service, Maintenance & Skilled TradesEducation: mastersSkills: ["Technical leadership","Hands-on problem solving","Engineering judgment","Mentoring","Execution across cross-functional teams"]

Lead the mechanical architecture and advanced packaging design for next-generation high-performance computing, AI, and semiconductor products. Own concept-to-production mechanical design, CAD development, thermo-mechanical analysis, and FEA-driven stress/warpage/reliability modeling. Partner cross-functionally and with suppliers to optimize performance and manufacturability, and drive qualification, failure analysis, and root-cause investigations through NPI and production ramp.

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FursaFursa
AMD
AMD
1 day ago

Principal Mechanical Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Lead the mechanical architecture and advanced packaging design for next-generation high-performance computing, AI, and semiconductor products. Own concept-to-production mechanical design, CAD development, thermo-mechanical analysis, and FEA-driven stress/warpage/reliability modeling. Partner cross-functionally and with suppliers to optimize performance and manufacturability, and drive qualification, failure analysis, and root-cause investigations through NPI and production ramp.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Field Service, Maintenance & Skilled Trades
Seniority: Mid level

Key Responsibilities

  • •Lead mechanical architecture and design strategy for advanced semiconductor packaging solutions.
  • •Drive mechanical design, CAD development, and thermo-mechanical analysis from concept through production.
  • •Conduct and guide stress, warpage, reliability, and package-board interaction modeling using FEA tools.
  • •Partner with silicon, packaging, thermal, reliability, manufacturing, and supplier teams to optimize performance and manufacturability.
  • •Lead qualification, failure analysis, and root-cause investigations across NPI and production ramp.

Key Requirements

  • •MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or a related technical field (bachelors and equivalent industry experience may be considered).
  • •Hands-on expertise with ANSYS Mechanical, Creo, and SolidWorks, plus mechanical simulation workflows.
  • •Deep knowledge of thermo-mechanical reliability, stress analysis, warpage, and package-board interaction modeling.
  • •Experience with advanced semiconductor packaging (e.g., flip-chip, chiplet, 2.5D/3D, interposer, or HBM-based architectures).
  • •Experience working with OSATs, foundries, substrate suppliers, and high-volume manufacturing partners.
Experience:SemiconductorHigh-performance hardwareAdvanced packagingNPIProduction ramp
Education:Master's in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics (or related technical field)
Skills:Technical leadershipHands-on problem solvingEngineering judgmentMentoringExecution across cross-functional teams
Languages:En-us
Tech Stack:ANSYS MechanicalCreoSolidWorksFEA

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
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Glassdoor: 3.9
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