Texas Instruments

2 months ago

Packaging Engineer | High Voltage & high power

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 12 hours agoStatus: Live

Job Summary

Define, design, develop, and scale to volume production high-voltage (200–3300V) semiconductor packages and high-power modules for industrial, automotive, renewable, and telecom markets. Translate market trends and end-equipment requirements into forward-looking packaging roadmaps. Lead HV technology solutions across GaN, SiC, IGBT, and isolation technologies, validating with CFD, thermomechanical, and electrical parasitic extraction tools while building reliability and manufacturing-ready process flows.

Location: Dallas

Workplace: Onsite

Employment Type: Full time

Job Function: Energy & Utilities Operations

Seniority: Mid level

Key Responsibilities

•Define, design, develop, and scale to volume production high-voltage packages and high-power modules for multiple markets.
•Translate market trends and end equipment system requirements into competitive package and module roadmaps.
•Develop HV technology solutions across GaN, SiC, IGBT, and isolation technologies and validate them using CFD, thermomechanical, and electrical parasitic extraction tools.
•Create first-article prototypes by developing new process flows/technologies and scale them to high-volume manufacturing.
•Outline reliability plans, complete testing, summarize failure modes, and propose solutions to address issues.

Key Requirements

•Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related engineering field.
•8+ years of experience in high voltage (200V–3300V) and high power (5kW–300kW) semiconductor packaging across GaN/SiC/IGBT and Super Junction MOSFET technologies.
•Hands-on design of high voltage package and power module structures, including materials, equipment, and assembly flow integration (e.g., TOLT, TOLG, Q-DPAK DIP, SIP, case modules).
•Strong knowledge of Silicon/GaN/SiC package interactions and hands-on stress, thermal, and electrical modeling analysis using relevant tools.
•Experience scaling HV packages and modules from concept to high-volume manufacturing and defining roadmaps with internal/external stakeholders.

Experience:8+ yearsSemiconductor packagingHigh voltagePower electronicsGaNSiCIGBT

Education:Master's in Mechanical Engineering; Materials Science; Electrical Engineering

Skills:CollaborationCommunicationLeadershipProblem solving

Tech Stack:GaNSiCIGBTCFDThermomechanical modelingElectrical parasitic extractionMold compoundsDie attachSubstratesTOLTTOLGQ-DPAKDIPSIPDBCX substratesClip attachFlip chip packagingWafer bumpingMagneticsThermoelectrical modeling

Company Brief

Texas Instruments

Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Dallas, United States

Founded: 1930

Website LinkedIn

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Texas Instruments

2 months ago

Packaging Engineer | High Voltage & high power

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 12 hours agoStatus: Live

Job Summary

Location: Dallas

Workplace: Onsite

Employment Type: Full time

Job Function: Energy & Utilities Operations

Seniority: Mid level

Key Responsibilities

•Define, design, develop, and scale to volume production high-voltage packages and high-power modules for multiple markets.
•Translate market trends and end equipment system requirements into competitive package and module roadmaps.
•Develop HV technology solutions across GaN, SiC, IGBT, and isolation technologies and validate them using CFD, thermomechanical, and electrical parasitic extraction tools.
•Create first-article prototypes by developing new process flows/technologies and scale them to high-volume manufacturing.
•Outline reliability plans, complete testing, summarize failure modes, and propose solutions to address issues.

Key Requirements

•Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related engineering field.
•8+ years of experience in high voltage (200V–3300V) and high power (5kW–300kW) semiconductor packaging across GaN/SiC/IGBT and Super Junction MOSFET technologies.
•Hands-on design of high voltage package and power module structures, including materials, equipment, and assembly flow integration (e.g., TOLT, TOLG, Q-DPAK DIP, SIP, case modules).
•Strong knowledge of Silicon/GaN/SiC package interactions and hands-on stress, thermal, and electrical modeling analysis using relevant tools.
•Experience scaling HV packages and modules from concept to high-volume manufacturing and defining roadmaps with internal/external stakeholders.

Experience:8+ yearsSemiconductor packagingHigh voltagePower electronicsGaNSiCIGBT

Education:Master's in Mechanical Engineering; Materials Science; Electrical Engineering

Skills:CollaborationCommunicationLeadershipProblem solving

Company Brief

Texas Instruments

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Dallas, United States

Founded: 1930

Website LinkedIn