CPU Core Physical Design Thermal Modeling Lead

AMD
Santa Clara, Austin
Workplace: HybridFull timeUSD 175,000 - 300,000 annuallyFunction: Design (Product/UX/UI/Visual)Skills: ["Cross-functional alignment","Execution-driven","Technical leadership","Issue closure","Organizational skills"]

Lead physical design thermal modeling for CPU cores and SoC to meet thermal requirements and silicon performance. Own and drive physical design methodology for power and thermals across IPs, partnering with package modeling teams to align constraints, improve thermal profile through new design/analysis methods, and ensure on-time closure of milestones, risks, and dependencies.

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FursaFursa
AMD
AMD
5 days ago

CPU Core Physical Design Thermal Modeling Lead

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Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live

Job Summary

Lead physical design thermal modeling for CPU cores and SoC to meet thermal requirements and silicon performance. Own and drive physical design methodology for power and thermals across IPs, partnering with package modeling teams to align constraints, improve thermal profile through new design/analysis methods, and ensure on-time closure of milestones, risks, and dependencies.
Location: Santa Clara, Austin
Workplace: Hybrid
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

  • •Drive development and alignment of thermal modeling methodology, collaborating with package modeling teams across AMD products.
  • •Develop new design and analysis methodologies to improve product thermal profiles.
  • •Translate product usage model, workload, and package requirements into IP performance, power, and thermal constraints and align with product performance-power models.
  • •Drive thermal product requirements across functions and manage critical deliverables at key project milestones.
  • •Ensure timely closure and multi-dimensional alignment of power, thermal management, and performance constraints.

Pay and Benefits

Salary: USD 175,000 - 300,000 annually

Key Requirements

  • •Strong physical design background with extensive EDA tool experience.
  • •Excellent knowledge of physical design power and performance metrics for high-performance SoC/IP design.
  • •Familiarity with package models and advanced packaging designs.
  • •Expertise in scripting and flow automation.
  • •Bachelor’s or Master’s degree in computer engineering or electrical engineering.
Education:
Skills:Cross-functional alignmentExecution-drivenTechnical leadershipIssue closureOrganizational skills
Languages:English
Tech Stack:EDA toolsScriptingFlow automation

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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