MTB PWF BOND Process Engineer
Taiwan
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: []Own and continuously improve wafer bonding process conditions for semiconductor manufacturing. You’ll upgrade process capability to reduce production costs, define and refine process parameters across semiconductor equipment, and lead process management project setup/modification. The role also evaluates and promotes new equipment and materials, performing abnormal analysis and driving improvements to stabilize and advance production outcomes.
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