Intern - HBM Design Architect | MS or PhD Student

Micron Technology
Texas
Workplace: OnsiteInternshipFunction: Hardware, Embedded & Systems EngineeringSkills: ["Problem-solving","Analytical","Written communication","Verbal communication","Root-cause analysis"]

Work on the Heterogeneous Integration Group’s HBM Architecture team to evaluate HBM and DRAM architecture concepts. Build analytical models and simulations, analyze design tradeoffs across performance, power, thermal behavior, reliability, and manufacturability, and collaborate across architecture through system engineering to generate evidence-based recommendations. Apply LLMs, generative AI, and AI-assisted workflows to improve engineering analysis, research, and productivity, and present findings to cross-functional teams.

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Micron Technology
Micron Technology
1 week ago

Intern - HBM Design Architect | MS or PhD Student

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Job Summary

Work on the Heterogeneous Integration Group’s HBM Architecture team to evaluate HBM and DRAM architecture concepts. Build analytical models and simulations, analyze design tradeoffs across performance, power, thermal behavior, reliability, and manufacturability, and collaborate across architecture through system engineering to generate evidence-based recommendations. Apply LLMs, generative AI, and AI-assisted workflows to improve engineering analysis, research, and productivity, and present findings to cross-functional teams.
Location: Texas
Workplace: Onsite
Employment Type: Internship
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Intern level

Key Responsibilities

  • •Analyze HBM and DRAM architecture tradeoffs including timing, bandwidth, power, area, thermal performance, reliability, and design complexity using analytical and simulation/AI-assisted methods.
  • •Develop first-order models, simulations, and data-analysis tools to compare alternatives, identify sensitivities, and support architecture pathfinding studies.
  • •Collaborate across architecture, circuit design, verification, layout, packaging, product, and system engineering to assess feasibility and technology tradeoffs.
  • •Review simulation, experimental, and silicon data to perform root-cause analysis, validate assumptions, improve model accuracy, and provide evidence-based recommendations.
  • •Use LLMs, generative AI, and AI-assisted engineering workflows to enhance analysis, technical research, productivity, and to document and present results.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysParental LeaveEquityWellness StipendLearning Budget

Key Requirements

  • •Currently pursuing a Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related field, and returning to the degree program after the internship.
  • •Strong academic foundation in at least two areas such as CMOS circuits, digital or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, power delivery, signal integrity, or advanced packaging.
  • •Experience using engineering analysis, modeling, or simulation tools via graduate research, coursework, laboratory projects, or internships.
  • •Ability to define assumptions, perform technical analysis, evaluate results, and communicate evidence-based conclusions.
  • •Strong problem-solving, analytical, written communication, and verbal communication skills.
Education:
Skills:Problem-solvingAnalyticalWritten communicationVerbal communicationRoot-cause analysis
Tech Stack:HBMDRAMCMOS circuitsDigital designMixed-signal designSemiconductor devicesComputer architectureMemory systemsThermal sciencesPower deliverySignal integrityAdvanced packagingLarge Language Models (LLMs)Generative AIAI Assisted engineering workflowsHSPICEFineSimSpectreData analysisSimulation

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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