Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceExperience: 2+ yearsEducation: bachelorsSkills: ["Problem-solving","Data analysis","Tenacity","Collaboration","Continuous improvement","Judgment"]

Develop and enable advanced inspection and metrology techniques for semiconductor advanced packaging technologies. Own recipe development and optimization, in-line characterization, and metrology validation, while analyzing data to improve yield and process efficiency. Manage metrology tools and quality indicators (including OCAP and SPC charts), and collaborate across teams to integrate new technologies into packaging development and launch roadmaps, including AI-assisted workflows.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Develop and enable advanced inspection and metrology techniques for semiconductor advanced packaging technologies. Own recipe development and optimization, in-line characterization, and metrology validation, while analyzing data to improve yield and process efficiency. Manage metrology tools and quality indicators (including OCAP and SPC charts), and collaborate across teams to integrate new technologies into packaging development and launch roadmaps, including AI-assisted workflows.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize metrology recipes for semiconductor processes, ensuring they are accurate and efficient for production needs.
  • •Establish inspection methodologies and best-known methods, and perform in-line characterization and validation of metrology recipes.
  • •Use data analysis tools (including Power BI) to summarize and report metrology recipe status and project progress; identify improvement opportunities.
  • •Own and manage metrology tools to meet performance and quality standards, including defense line readiness and control plans (OCAP, SPC charts).
  • •Collaborate across teams to integrate advanced packaging metrology and RDA technologies into process flows and enable roadmap development.

Key Requirements

  • •B.S./M.S./Ph.D. (or equivalent) in Mechanical, Chemical, Electrical Engineering, Physics, or a related technical field.
  • •2+ years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control, and packaging.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • •Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
  • •Hands-on experience with wafer/assembly tools or metrology/RDA systems, with strong problem-solving and root-cause focus.
Experience:2+ yearsSemiconductorAdvanced packaging
Education:Bachelor's
Skills:Problem-solvingData analysisTenacityCollaborationContinuous improvementJudgment
Tech Stack:PythonRSQLPower BIVisual BasicE3FDCRMSSPCDOEOCAP

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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