Senior Die Bond/Die Attach Equipment Engineer

Texas Instruments
Kuala Lumpur
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Communication","Analytical thinking","Problem solving","Team collaboration","Time management"]

Evaluate and select cost-effective semiconductor die bond/die attach equipment, and lead installation, modifications, upgrades, and ongoing maintenance. Monitor equipment performance and reliability, study manufacturer technical notices, and create uptime-improvement solutions for manufacturing issues. Provide technical support to equipment repair and process engineering teams, define preventive maintenance schedules, and apply semiconductor manufacturing knowledge and SPC techniques in a fast-paced cleanroom environment.

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Texas Instruments
Texas Instruments
3 days ago

Senior Die Bond/Die Attach Equipment Engineer

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Last checked: 11 hours agoStatus: Live

Job Summary

Evaluate and select cost-effective semiconductor die bond/die attach equipment, and lead installation, modifications, upgrades, and ongoing maintenance. Monitor equipment performance and reliability, study manufacturer technical notices, and create uptime-improvement solutions for manufacturing issues. Provide technical support to equipment repair and process engineering teams, define preventive maintenance schedules, and apply semiconductor manufacturing knowledge and SPC techniques in a fast-paced cleanroom environment.
Location: Kuala Lumpur
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Evaluate, select, and order equipment that is appropriate and cost effective for manufacturing company products.
  • •Oversee installation, modification, upgrades, and maintenance of manufacturing equipment.
  • •Stay current on equipment manufacturers’ technical notices, upgrades, and safety issues.
  • •Study equipment performance and reliability; establish programs to increase uptime and address equipment problems affecting manufacturing.
  • •Provide technical support to equipment repair and process engineering organizations, including defining preventive maintenance schedules.

Key Requirements

  • •Bachelor’s degree in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering, or Physics/related engineering.
  • •Minimum 5 years of hands-on die bond or die attach equipment experience.
  • •Equipment experience with AMAT PVD and/or AMAT TxZ chambers.
  • •Prior experience with PVD, CVD, high vacuum and/or ultra high vacuum.
  • •Working knowledge of semiconductor manufacturing and SPC techniques, including semiconductor cleanroom protocol behaviors.
Experience:5+ yearsSemiconductor manufacturingCleanroom
Education:Bachelor's
Skills:CommunicationAnalytical thinkingProblem solvingTeam collaborationTime management
Tech Stack:AMAT PVDAMAT TxZPVDCVDHigh vacuumUltra high vacuumTool monitoring softwareSPCSemiconductor cleanroom protocol

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn