Advanced Packaging Reliability Lab Engineer

Join the Stress Testing and Reliability Laboratory to help qualify and advance Intel’s next-generation packaging technologies. You’ll support environmental stress systems that evaluate reliability under thermal cycling, temperature extremes, and humidity exposure. Work hands-on with DC power and measurement equipment (power supplies, DMMs, thermocouples, DAQ), improve test methods and specifications, develop statistical process control, and collaborate with operations, planning, facilities, and tool vendors to deliver trusted test environments and high-quality data.