Cisco

2 months ago

ASIC Packaging Development Technical Leader

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 2 hours agoStatus: Live

Job Summary

Lead and drive ASIC packaging and assembly technology development for Cisco’s high-performance network CPUs. In a collaborative CHG environment, you will partner with ASIC design, packaging physical designers, and PI/SI engineers, engage with suppliers, and influence the technical direction to advance 2.5D/3D integration, CoWoS/Co-packaged optics, and substrate manufacturing for next-generation high-performance ASICs.

Location: Taipei

Workplace: Hybrid

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Serve as a technical expert for advanced packaging technologies (2.5D/3D with RDL CoW processes, large body packaging assembly, Co-Packaged Optics, Co-Packaged Copper) and lead integration efforts
•Develop test vehicle strategy and design for advanced package technologies with 2.5D/3D integration stacking process
•Engage with leading assembly suppliers to understand assembly process, module design rules and requirements
•Define assembly process integration and flow for advanced heterogeneous integration including Co-packaged Optics and Co-packaged Copper package integration solution
•Develop comprehensive plan to evaluate and qualify new package technologies

Key Requirements

•BS/MS/PhD in Mechanical Engineering, Materials Science, Physics or a closely related field
•8+ years of progressive experience in Semiconductor Packaging and Assembly Industry, with demonstrated skill and experience leading technical projects or initiatives
•Previously proven experience in advanced packaging technology development and execution, such as 2.5D/3D process integration, heterogeneous integration, wafer-level packaging, and package technology qualification method
•Comprehensive knowledge and understanding of advanced CoWoS package assembly and manufacturing flow
•Fluent in English and Chinese Mandarin communication

Experience:8+ yearsSemiconductorPackagingASIC

Education:

Skills:LeadershipCommunicationProblem-solvingInfluencingTeamwork

Languages:EnglishMandarin

Tech Stack:2.5D3D packagingCoWoSCo-packaged OpticsCo-packaged CopperWafer-level packagingDfMDfROSAT

Company Brief

Cisco

Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.

Industry: Networking Equipment

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: San Jose, United States

Founded: 1984

Glassdoor: 4.0

Website LinkedIn Glassdoor

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Cisco

2 months ago

ASIC Packaging Development Technical Leader

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 2 hours agoStatus: Live

Job Summary

Location: Taipei

Workplace: Hybrid

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Serve as a technical expert for advanced packaging technologies (2.5D/3D with RDL CoW processes, large body packaging assembly, Co-Packaged Optics, Co-Packaged Copper) and lead integration efforts
•Develop test vehicle strategy and design for advanced package technologies with 2.5D/3D integration stacking process
•Engage with leading assembly suppliers to understand assembly process, module design rules and requirements
•Define assembly process integration and flow for advanced heterogeneous integration including Co-packaged Optics and Co-packaged Copper package integration solution
•Develop comprehensive plan to evaluate and qualify new package technologies

Key Requirements

•BS/MS/PhD in Mechanical Engineering, Materials Science, Physics or a closely related field
•8+ years of progressive experience in Semiconductor Packaging and Assembly Industry, with demonstrated skill and experience leading technical projects or initiatives
•Previously proven experience in advanced packaging technology development and execution, such as 2.5D/3D process integration, heterogeneous integration, wafer-level packaging, and package technology qualification method
•Comprehensive knowledge and understanding of advanced CoWoS package assembly and manufacturing flow
•Fluent in English and Chinese Mandarin communication

Experience:8+ yearsSemiconductorPackagingASIC

Education:

Skills:LeadershipCommunicationProblem-solvingInfluencingTeamwork

Languages:EnglishMandarin

Tech Stack:2.5D3D packagingCoWoSCo-packaged OpticsCo-packaged CopperWafer-level packagingDfMDfROSAT

Company Brief

Cisco

Industry: Networking Equipment

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: San Jose, United States

Founded: 1984

Glassdoor: 4.0

Website LinkedIn Glassdoor