ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Product ManagementSkills: ["Attention to detail","Communication","Collaboration","Problem-solving","Willingness to learn"]

Join the Package Development Engineering organization as an early-career Engineer supporting NAND package and silicon integration for next-generation memory products. Work with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams. You’ll help with chip-package interaction assessments, investigate wafer dicing/singulation topics, support DFMEA/PFMEA and yield/quality investigations, and contribute to test vehicles and design review documentation.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

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Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live

Job Summary

Join the Package Development Engineering organization as an early-career Engineer supporting NAND package and silicon integration for next-generation memory products. Work with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams. You’ll help with chip-package interaction assessments, investigate wafer dicing/singulation topics, support DFMEA/PFMEA and yield/quality investigations, and contribute to test vehicles and design review documentation.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Entry level

Key Responsibilities

  • •Support chip-package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers.
  • •Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics.
  • •Participate in DFMEA/PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items.
  • •Support investigations related to yield, quality, and manufacturability with wafer fab, R&D, and manufacturing teams.
  • •Support execution of test vehicles and DOEs, including data collection, basic analysis, and report preparation.

Key Requirements

  • •Bachelor’s or Master’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related discipline).
  • •Less than 2 years of relevant experience, including internships, co-op programs, or research experience in semiconductor, materials, or manufacturing fields.
  • •Fundamental understanding of semiconductor manufacturing and/or packaging concepts at coursework or internship level.
  • •Exposure to structured problem-solving methods such as FMEA, DOE, and data analysis through academics or internships.
  • •Basic proficiency in Microsoft Excel, Word, and PowerPoint for data analysis and documentation, with strong written and verbal communication skills.
Education:
Skills:Attention to detailCommunicationCollaborationProblem-solvingWillingness to learn
Tech Stack:Microsoft ExcelMicrosoft WordMicrosoft PowerPoint

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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