Thin Films Module Development Engineer

Intel
United States
Workplace: OnsiteFull timeUSD 133,800 - 188,890 annuallyFunction: Product ManagementExperience: 1+ yearsEducation: phdSkills: ["Communication","Collaboration","Problem-solving","Independent engineering judgement","Written documentation"]

Own thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related platforms. Design, implement, and optimize processes to meet material, device, yield, and process control targets; plan experiments and analyze process data to accelerate yield improvements. Use equipment principles, characterization, and metrology to support technology development, partner across teams, and contribute to next-generation semiconductor process pathfinding through screening and silicon validation.

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Intel
Intel
4 days ago

Thin Films Module Development Engineer

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Job Summary

Own thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related platforms. Design, implement, and optimize processes to meet material, device, yield, and process control targets; plan experiments and analyze process data to accelerate yield improvements. Use equipment principles, characterization, and metrology to support technology development, partner across teams, and contribute to next-generation semiconductor process pathfinding through screening and silicon validation.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Entry level

Key Responsibilities

  • •Deliver metals process definition, development, and optimization in metal deposition modules for advanced process development.
  • •Own thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms.
  • •Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement.
  • •Apply expertise in equipment operating principles, materials characterization, and metrology to accelerate technology learning cycles.
  • •Partner with cross-functional teams on material and process screening, equipment selection/qualification, design for manufacturability, and technology pathfinding.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field.
  • •1+ years of experience with thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, or electrochemical deposition.
  • •Ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design.
  • •Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, and defect inspection.
  • •Proficiency with data analysis software including JMP, Excel, Python, R, or SQL.
Experience:1+ yearsSemiconductorsThin films
Education:PhD / Doctorate
Skills:CommunicationCollaborationProblem-solvingIndependent engineering judgementWritten documentation
Tech Stack:ALDCVDPVDSputteringEvaporationElectrochemical depositionJMPExcelPythonRSQLXRFXPSXRDSEMTEMEllipsometryDefect inspectionMOSFETFinFET

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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