Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunitySkills: ["Analytical thinking","Problem-solving","Communication","Leadership","Stakeholder management"]

Develop and optimize advanced semiconductor assembly processes for die-level packaging (wafer-level packaging, chip-on-wafer, and chip-to-wafer) to meet performance, cost, manufacturability, quality, reliability, and schedule goals. Evaluate equipment and materials, drive quality/yield improvements using process data, and provide defense coverage and correlations. Coordinate technology development across internal and external stakeholders, and support smooth transfer from early development through high-volume manufacturing.

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FursaFursa
Micron Technology
Micron Technology
6 days ago

Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

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Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Develop and optimize advanced semiconductor assembly processes for die-level packaging (wafer-level packaging, chip-on-wafer, and chip-to-wafer) to meet performance, cost, manufacturability, quality, reliability, and schedule goals. Evaluate equipment and materials, drive quality/yield improvements using process data, and provide defense coverage and correlations. Coordinate technology development across internal and external stakeholders, and support smooth transfer from early development through high-volume manufacturing.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking (chip on wafer, chip to wafer).
  • •Improve product quality by driving yield improvements, reducing costs, and enhancing productivity through process management projects.
  • •Evaluate and promote new semiconductor equipment and materials; set and refine process parameters and plan for new capabilities.
  • •Conduct quality improvement using defense coverage and correlations, plus continuous data analysis to establish advanced controls and identify improvement opportunities.
  • •Coordinate technology development and integration flows with internal and external stakeholders; provide POR/MOR documentation to support transition through qualification to high-volume manufacturing.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendHealth InsuranceEquity

Key Requirements

  • •PhD (≥2 years), or Master’s (≥5 years), or Bachelor’s (≥7 years) in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related fields.
  • •Semiconductor process development or equipment evaluation experience, preferably wafer bonding, die stacking, and packaging.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • •Experience with Visual Basic for automation and tool integration.
  • •Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Experience:SemiconductorsSemiconductor manufacturingWafer bondingDie stackingAdvanced packagingAI-enabled tools
Education:
Skills:Analytical thinkingProblem-solvingCommunicationLeadershipStakeholder management
Tech Stack:PythonRSQLVisual BasicE3FDCRMSSPCDOE

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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