Principal Engineer Advanced Package Technology Development

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsEducation: phdSkills: ["Strategic thinking","Collaboration","Technical leadership","Innovation"]

Lead innovation in advanced packaging technology as part of Micron’s Advanced Package Technology Development team. Based at the Boise campus, you will drive technology roadmaps and investment priorities by applying deep expertise in High Bandwidth Memory, 2.5D/3D integration, hybrid bonding, and wafer-level packaging processes. You’ll analyze competitive trends, shape trade-offs using cost/value analysis, collaborate with partners, and help translate technical insights into business impact, patents, and quality improvements.

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Micron Technology
Micron Technology
1 month ago

Principal Engineer Advanced Package Technology Development

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Job Summary

Lead innovation in advanced packaging technology as part of Micron’s Advanced Package Technology Development team. Based at the Boise campus, you will drive technology roadmaps and investment priorities by applying deep expertise in High Bandwidth Memory, 2.5D/3D integration, hybrid bonding, and wafer-level packaging processes. You’ll analyze competitive trends, shape trade-offs using cost/value analysis, collaborate with partners, and help translate technical insights into business impact, patents, and quality improvements.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Deliver high-value, differentiated packaging technology solutions by driving technical innovation for business value.
  • •Develop and guide packaging technology roadmaps and investment priorities using cost and value analysis.
  • •Collaborate with internal and external partners to ensure seamless technology integration.
  • •Analyze competitive trends and metrics using data intelligence to strengthen Micron’s competitive edge.
  • •Define requirements using proven technical data and contribute to innovation through patents, trade secrets, and technical publications.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Leave

Key Requirements

  • •Over 5 years of professional experience in semiconductor advanced packaging.
  • •BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field (or equivalent experience).
  • •Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including hybrid bonding.
  • •Hands-on process module engineering experience in wafer level packaging or 3D stacking process.
  • •Experience in DRAM manufacturing and OSAT companies.
Experience:5+ yearsSemiconductorsDRAMAdvanced packaging
Education:PhD / Doctorate in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field
Skills:Strategic thinkingCollaborationTechnical leadershipInnovation
Languages:English
Tech Stack:High Bandwidth Memory2.5D integration3D integrationHybrid bondingWafer Level Packaging3D stacking processDRAMOSATPatentsTrade secretsTechnical presentationsPapers

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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