Semiconductor Packaging Research Engineer

Intel
Phoenix
Workplace: HybridFull timeUSD 122,440 - 232,190 annuallyFunction: Research & Scientific (R&D)Experience: 1+ yearsEducation: mastersSkills: ["Cross-functional communication","Scientific problem-solving","Documentation","Technical planning"]

Drive research for advanced semiconductor packaging and heterogeneous integration, including chiplets, 2.5D/3DIC, hybrid bonding, interposers, and die-to-die interconnects. Work on either process integration learning or modeling/simulation to evaluate feasibility, reliability, manufacturability, and technology readiness. Translate product needs into research plans and deliverables, and collaborate across research, design, process, materials, reliability, manufacturing, suppliers, universities, and the ecosystem.

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Intel
Intel
3 days ago

Semiconductor Packaging Research Engineer

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Job Summary

Drive research for advanced semiconductor packaging and heterogeneous integration, including chiplets, 2.5D/3DIC, hybrid bonding, interposers, and die-to-die interconnects. Work on either process integration learning or modeling/simulation to evaluate feasibility, reliability, manufacturability, and technology readiness. Translate product needs into research plans and deliverables, and collaborate across research, design, process, materials, reliability, manufacturing, suppliers, universities, and the ecosystem.
Location: Phoenix
Workplace: Hybrid
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Entry level

Key Responsibilities

  • •Research advanced packaging concepts including chiplets, heterogeneous integration, 2.5D/3DIC, hybrid bonding, interposers, and die-to-die interconnects.
  • •Perform process integration learning or modeling/simulation to assess feasibility, reliability, manufacturability, and technology readiness.
  • •For process integration, define integration flows, research vehicles, DOE, defect/yield learning, qualification evidence, and risk mitigation paths.
  • •For modeling, develop and validate thermal, thermo-mechanical, electrical, reliability, or multi-physics models using experimental and failure analysis data.
  • •Translate product needs into research hypotheses, plans, and recommendations; document outputs through reports, design guidance, IP, publications, and development-transfer inputs.

Pay and Benefits

Salary: USD 122,440 - 232,190 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Master’s or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, Computational Mechanics, Microelectronics, Semiconductor Manufacturing, or a related field.
  • •1+ years’ experience in semiconductor packaging research and advanced packaging integration, process integration, modeling/simulation, reliability, materials, or heterogeneous integration.
  • •1+ years’ experience in process integration, research vehicle execution, DOE, defect/yield learning, reliability, model development/validation, or multi-physics simulation.
  • •1+ years’ experience with advanced packaging technologies such as flip chip, chiplets, 2.5D/3DIC, fan-out, hybrid bonding, interposers, HBM integration, advanced substrates, or die-to-die interconnects.
  • •Demonstrated ability to develop clear assumptions, learning milestones, qualification metrics, and actionable recommendations from ambiguous research problems.
Experience:1+ years
Education:Master's
Skills:Cross-functional communicationScientific problem-solvingDocumentationTechnical planning
Tech Stack:ANSYSAbaqusCOMSOLHFSSCadenceMATLABPythonJMP

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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