Packaging Module Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 99,030 - 162,500 annuallyFunction: Product ManagementExperience: 4+ yearsEducation: bachelorsSkills: ["Problem-solving","Troubleshooting","Data analysis","Consultation","Continuous improvement"]

Develop and improve assembly processes and equipment for semiconductor packaging platform technologies, ensuring progress toward targets for quality, reliability, cost, yield, productivity, and manufacturability. Create process and equipment specifications, evaluate packaging under simulated field conditions, and support cycle and flow improvements. Partner with supplier quality and procurement to meet material and vendor performance requirements, and apply statistical methods to accelerate problem identification and reliability.

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Intel
Intel
2 days ago

Packaging Module Development Engineer

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Last checked: 2 hours agoStatus: Live

Job Summary

Develop and improve assembly processes and equipment for semiconductor packaging platform technologies, ensuring progress toward targets for quality, reliability, cost, yield, productivity, and manufacturability. Create process and equipment specifications, evaluate packaging under simulated field conditions, and support cycle and flow improvements. Partner with supplier quality and procurement to meet material and vendor performance requirements, and apply statistical methods to accelerate problem identification and reliability.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Develop assembly processes and/or equipment to enable Intel packaging platform technology roadmap.
  • •Optimize and improve manufacturing efficiency while meeting quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • •Develop process and equipment specifications and document improvements using white papers and experimental design/data analysis.
  • •Maintain equipment and evaluate silicon and package technologies under simulated field use conditions.
  • •Lead efforts to innovate, solve packaging problems, and continuously improve processes using experimental design and statistical methods.

Pay and Benefits

Salary: USD 99,030 - 162,500 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor's degree with 4+ years of experience (or Master's with 2+ years) in Engineering, Physics, Computer Science, or related fields.
  • •US Citizenship required.
  • •Ability to obtain and maintain a US Government Security Clearance.
  • •1+ years of experience in manufacturing-related inspection (wafer, package, component, part, etc.).
  • •Statistical principles, process control (SPC), and Design of Experiments (DOE).
Experience:4+ yearsManufacturingSemiconductors
Education:Bachelor's
Skills:Problem-solvingTroubleshootingData analysisConsultationContinuous improvement
Tech Stack:PythonOpenCV

Eligibility

Nationality:US National
Security Clearance:US Government Security Clearance

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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