2027 Masters ASIC Package Engineering Co-op/Intern

AMD
San Jose, Santa Clara
InternshipFunction: Hardware, Embedded & Systems EngineeringEducation: mastersSkills: []

Join the ASIC Package Engineering team as a Masters co-op/intern to help bring advanced packaging technology to reality. You’ll support package design and development engineers, learn substrate/interposer/bump design for AMD products, and contribute to design verification implementation. The role includes analyzing yield and defect metrics to improve design performance, and evaluating/benchmarking packaging materials with partners to balance cost, performance, and yield requirements.

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FursaFursa
AMD
AMD
1 day ago

2027 Masters ASIC Package Engineering Co-op/Intern

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Job Summary

Join the ASIC Package Engineering team as a Masters co-op/intern to help bring advanced packaging technology to reality. You’ll support package design and development engineers, learn substrate/interposer/bump design for AMD products, and contribute to design verification implementation. The role includes analyzing yield and defect metrics to improve design performance, and evaluating/benchmarking packaging materials with partners to balance cost, performance, and yield requirements.
Location: San Jose, Santa Clara
Employment Type: Internship
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Intern level

Key Responsibilities

  • •Support package design and package development engineers in prioritizing and optimizing new projects.
  • •Train to complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates.
  • •Work on design verification implementation projects to ensure performance, quality, and efficiency.
  • •Analyze yield and defect metrics to help improve design performance and yield.
  • •Evaluate and benchmark packaging materials and interact with partners to achieve cost-efficient designs meeting performance and yield requirements.

Key Requirements

  • •Currently enrolled in a US-based university in a Masters degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
  • •Knowledge or experience with transmission lines and electric circuits (course related).
  • •Experience with package, silicon, or PCB design software.
  • •Programming/scripting skills in Perl, Python, or SQL.
  • •Knowledge of semiconductor theory and packaging process/technology, plus data analytics and data visualization tools like PowerBI.
Education:Master's
Languages:En-us
Tech Stack:PerlPythonSQLPowerBI

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn