Principal/Senior Advanced Packaging Development Process Engineer

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 3+ yearsEducation: mastersSkills: ["Technical problem-solving","Root-cause investigation","Collaboration","Ownership mindset","Prioritization"]

Develop and qualify next-generation advanced packaging and assembly processes for future memory and semiconductor products. Own process development from concept through manufacturing transfer, including hybrid bonding, thermo-compression bonding, and flip chip. Design and analyze DOE to improve yield, reliability, and manufacturability, drive root-cause investigations using statistical methods, and monitor process health with SPC/FDC and metrology. Collaborate cross-functionally to accelerate technology readiness for high-volume production.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
5 days ago

Principal/Senior Advanced Packaging Development Process Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 10 hours agoStatus: Live

Job Summary

Develop and qualify next-generation advanced packaging and assembly processes for future memory and semiconductor products. Own process development from concept through manufacturing transfer, including hybrid bonding, thermo-compression bonding, and flip chip. Design and analyze DOE to improve yield, reliability, and manufacturability, drive root-cause investigations using statistical methods, and monitor process health with SPC/FDC and metrology. Collaborate cross-functionally to accelerate technology readiness for high-volume production.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and qualify next-generation advanced packaging and assembly technologies, including Hybrid Bonding, Thermo-Compression Bonding (TCB), Flip Chip, and emerging packaging solutions.
  • •Design, execute, and analyze DOE to optimize process performance, yield, reliability, and manufacturability.
  • •Lead process development work such as process setup, characterization, defect reduction, and process window optimization.
  • •Perform technical data analysis and drive root-cause investigations using statistical methods and engineering principles.
  • •Monitor process health using SPC, FDC, metrology, and reliability data, and support manufacturing transfer, documentation, and customer sample builds.

Pay and Benefits

Perks:Paid LeaveLearning BudgetHealth InsuranceDentalVisionEquity

Key Requirements

  • •Master's degree or higher in Materials Science, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.
  • •Minimum 3 years of experience in semiconductor process development, process integration, advanced packaging, or assembly technology.
  • •Hands-on experience in one or more of: Hybrid Bonding (C2W, W2W, D2D), Thermo-Compression Bonding (TCB), Flip Chip Assembly, or Advanced Packaging Process Development.
  • •Experience with DOE methodologies, data analysis, and process characterization, along with strong analytical and statistical problem-solving skills.
  • •Fluency in written and verbal English and proven ability to collaborate across global, cross-functional teams.
Experience:3+ yearsSemiconductors
Education:Master's
Skills:Technical problem-solvingRoot-cause investigationCollaborationOwnership mindsetPrioritization
Languages:English
Tech Stack:DOESPCFDCMetrologyReliability dataArtificial intelligenceMachine learningAutomationData analytics

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn