Intel

3 weeks ago

Staff Process Engineer, Dry Etch

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Join Intel’s Manufacturing Development Customer Engineering (MDCE) team to advance foundry technology from qualification to high-yield production. You’ll drive dry etch process integration and feasibility studies, optimize manufacturing output, and collaborate with Logic Technology Development and Technology & Foundry Supply Manufacturing teams. Lead equipment metrology, parameter optimization, and technology roadmaps for sub-3nm Gate-All-Around (GAA) FETs while mentoring technical leaders and influencing technical direction across the industry.

Location: Phoenix

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Drive technology development initiatives enabling both high-volume manufacturing and future technology advancement through process integration and equipment solutions.
•Conduct feasibility studies and lead design/development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
•Optimize production output for existing products and perform process technology feasibility studies using simulations and practical engineering methods.
•Partner with equipment and materials suppliers to develop enabling technology elements and build cost-sensitive technology roadmaps.
•Develop and mentor technical leaders, model Intel values, and collaborate closely with Logic Technology Development (LTD) and Technology & Foundry Supply Manufacturing (TFSM) teams to support customer requirements.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Bachelor’s degree in Electrical Engineering, Physics, Material Science, or a STEM field.
•4+ years of relevant semiconductor industry experience focused on dry etch modules.
•Experience in process development/leadership and semiconductor process or materials.
•Experience working with tool suppliers to optimize or customize solutions for manufacturing needs (dry etch leaders such as LAM, TEL, AMAT, and/or Hitachi).
•Extensive fab experience with a technical track record such as R&D, yield improvement, and/or defect reduction.

Experience:4+ yearsSemiconductor industryDry etchFoundry manufacturing

Education:Bachelor's

Skills:MentorshipTechnical leadershipCollaborationStrategic thinkingExecution

Tech Stack:Dry etchSub-3nmGate-All-Around (GAA) FETsLAMTELAMATHitachiFEOLMOLBEOLDOEParameter optimizationEquipment metrologyTheoretical simulations

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

3 weeks ago

Staff Process Engineer, Dry Etch

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Location: Phoenix

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Drive technology development initiatives enabling both high-volume manufacturing and future technology advancement through process integration and equipment solutions.
•Conduct feasibility studies and lead design/development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
•Optimize production output for existing products and perform process technology feasibility studies using simulations and practical engineering methods.
•Partner with equipment and materials suppliers to develop enabling technology elements and build cost-sensitive technology roadmaps.
•Develop and mentor technical leaders, model Intel values, and collaborate closely with Logic Technology Development (LTD) and Technology & Foundry Supply Manufacturing (TFSM) teams to support customer requirements.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Bachelor’s degree in Electrical Engineering, Physics, Material Science, or a STEM field.
•4+ years of relevant semiconductor industry experience focused on dry etch modules.
•Experience in process development/leadership and semiconductor process or materials.
•Experience working with tool suppliers to optimize or customize solutions for manufacturing needs (dry etch leaders such as LAM, TEL, AMAT, and/or Hitachi).
•Extensive fab experience with a technical track record such as R&D, yield improvement, and/or defect reduction.

Experience:4+ yearsSemiconductor industryDry etchFoundry manufacturing

Education:Bachelor's

Skills:MentorshipTechnical leadershipCollaborationStrategic thinkingExecution

Tech Stack:Dry etchSub-3nmGate-All-Around (GAA) FETsLAMTELAMATHitachiFEOLMOLBEOLDOEParameter optimizationEquipment metrologyTheoretical simulations

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor