Electro-Optical Interconnect Packaging Development Hardware Engineer (Onsite)

Design, qualify, validate, and debug advanced electro-optical interconnect packaging technologies for Cisco’s Silicon Core and Silicon One ASIC roadmaps. Perform SI/PI simulation and model-to-measurement correlation, thermal/material and dielectric characterization, and reliability/qualification testing. Conduct failure analysis using SEM/EDS, and build custom fixturing/prototypes with 3D CAD, 3D printing, and CNC milling. Partner with internal teams, OSATs, fabs, and suppliers to resolve complex packaging issues.