STAFF ENGINEER, MODULE HW VAL

Micron Technology
Hyderabad, Telangana, India
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 8+ yearsEducation: high_schoolSkills: ["Communication","Independent investigation","Mentoring","Technical reporting","Benchmarking"]

Own end-to-end module-level competitor analysis for DRAM DIMMs, including mechanical, electrical, and architectural comparisons. Conduct teardowns and reverse engineering to assess PCB layout, materials, shielding, non-DRAM components, and signal/power/thermal design tradeoffs. Benchmark margins and reliability across speed grades, then synthesize findings into technical reports for design, validation, and product engineering. Build a competitive intelligence repository and mentor junior engineers.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

STAFF ENGINEER, MODULE HW VAL

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live

Job Summary

Own end-to-end module-level competitor analysis for DRAM DIMMs, including mechanical, electrical, and architectural comparisons. Conduct teardowns and reverse engineering to assess PCB layout, materials, shielding, non-DRAM components, and signal/power/thermal design tradeoffs. Benchmark margins and reliability across speed grades, then synthesize findings into technical reports for design, validation, and product engineering. Build a competitive intelligence repository and mentor junior engineers.
Location: Hyderabad, Telangana, India
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Lead module-level competitor analysis across mechanical, electrical, and architectural comparisons.
  • •Perform teardown and reverse engineering of competitor DIMMs and analyze PCB layout, materials, shielding, and non-DRAM components.
  • •Assess signal integrity, power integrity, and thermal design choices versus internal and JEDEC raw card designs.
  • •Benchmark performance, margins, reliability, and design tradeoffs across speed grades and use cases.
  • •Collaborate with design, validation, and product engineering; produce executive-ready reports; maintain a competitive intelligence repository and mentor junior engineers.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Computer Engineering, or related field.
  • •8+ years of experience in DRAM module design, validation, or system-level hardware engineering.
  • •Strong understanding of DRAM module design, architecture, manufacturing, and JEDEC standards.
  • •Hands-on experience with hardware teardowns, schematics, layout reviews, or lab-based analysis.
  • •Strong written and verbal communication skills for presenting to senior technical and leadership audiences.
Experience:8+ yearsDRAMHardware teardownsValidationSystem-level hardware engineering
Education:High School in Electrical/Electronics Engineering or Computer Engineering
Skills:CommunicationIndependent investigationMentoringTechnical reportingBenchmarking
Tech Stack:DDR4DDR5JEDECPCB layoutSignal integrityPower integrityThermal designPMICVoltage RegulatorsRCDSPDOscilloscopeSI/PI toolsATEUHS

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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