Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceEducation: bachelorsSkills: ["Problem-solving","Attention to detail","Team collaboration","Communication"]

Define and build product reliability stress test flows, plans, and qualification execution to drive quality gates for High Bandwidth Memory (HBM). Partner with global Quality teams to execute qualification, resolve reliability gating issues, and reduce Time 0 and field DPM through optimized manufacturing test strategy. Perform root-cause analysis using electric and physical failure analysis, recommend process conversions to improve yield, and manage reliability risks with cross-functional partners across Fab, HBM teams, systems, and quality. Mentor others.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

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Canonical indexed version, validated from employer's careers page.

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Last checked: 14 hours agoStatus: Live
Reposted: first listed 12 hours ago

Job Summary

Define and build product reliability stress test flows, plans, and qualification execution to drive quality gates for High Bandwidth Memory (HBM). Partner with global Quality teams to execute qualification, resolve reliability gating issues, and reduce Time 0 and field DPM through optimized manufacturing test strategy. Perform root-cause analysis using electric and physical failure analysis, recommend process conversions to improve yield, and manage reliability risks with cross-functional partners across Fab, HBM teams, systems, and quality. Mentor others.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance

Key Responsibilities

  • •Define and develop reliability stress, test flows, and test plans covering product reliability aspects.
  • •Coordinate with Global Quality to define qualification plans, manage qualification execution progress, and drive gating issue resolution.
  • •Drive reductions in extrinsic (Time 0 and field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategy.
  • •Debug and identify root causes of reliability test failures and device issues using electric failure analysis (EFA) and physical failure analysis (PFA), and drive cross-functional improvements.
  • •Recommend process conversions to reduce cost and increase yields, manage DPM process conversion risks with product leaders, and mentor others.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical and Electronics Engineering (or related field).
  • •Experience in semiconductor devices, circuit design, or product validation is a plus.
  • •Ability to apply problem-solving methodologies to identify root causes and explore solution spaces.
  • •Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • •Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
Education:Bachelor's in Electrical and Electronics Engineering
Skills:Problem-solvingAttention to detailTeam collaborationCommunication
Tech Stack:PythonJMP

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn