Intel

1 week ago

Substrate Packaging Research and Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 day agoStatus: Live

Job Summary

Develop and qualify innovative substrate packaging assembly processes and equipment to advance the packaging technology roadmap. Drive process development, equipment optimization, and package reliability while improving manufacturing efficiency for advanced package assembly. Use engineering fundamentals, design of experiments, statistical analysis, and failure-mechanism understanding to create specifications, maintain evaluation equipment, set reliability requirements, and document improvements to support manufacturability, cost, yield, and quality.

Location: Phoenix

Workplace: Hybrid

Employment Type: Full time

Job Function: Research & Scientific (R&D)

Seniority: Mid level

Key Responsibilities

•Develop assembly processes and/or equipment using novel concepts to support future substrate packaging technology platforms.
•Optimize manufacturing efficiency and develop processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
•Create process and equipment specifications, applying design of experiments and data analysis, and document improvements through white papers.
•Develop and maintain equipment to evaluate silicon and package technologies under simulated field-use conditions (heat, humidity, temperature cycling, dynamic forces).
•Collaborate with contract assemblers, raw material vendors, and supplier quality/procurement teams to ensure material and process adherence, while developing techniques and quality screens to identify packaging reliability issues early.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related engineering field.
•2+ years of prior experience using engineering judgement and data analysis to draw conclusions, build models, and design experiments.
•Experience with materials science and engineering, including material characterization techniques.
•Experience with design of experiments, statistical data analysis, and statistical process control.
•Preferred: working knowledge or prior experience with optics and lasers, including laser micro-machining and micro-fabrication.

Experience:2+ years

Education:PhD / Doctorate in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering (or related engineering)

Skills:Problem-solvingEngineering judgmentStatistical analysis

Tech Stack:Design of experimentsStatistical data analysisStatistical process controlOpticsLasersLaser micro-machiningMicro-fabrication

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 week ago

Substrate Packaging Research and Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 day agoStatus: Live

Job Summary

Location: Phoenix

Workplace: Hybrid

Employment Type: Full time

Job Function: Research & Scientific (R&D)

Seniority: Mid level

Key Responsibilities

•Develop assembly processes and/or equipment using novel concepts to support future substrate packaging technology platforms.
•Optimize manufacturing efficiency and develop processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
•Create process and equipment specifications, applying design of experiments and data analysis, and document improvements through white papers.
•Develop and maintain equipment to evaluate silicon and package technologies under simulated field-use conditions (heat, humidity, temperature cycling, dynamic forces).
•Collaborate with contract assemblers, raw material vendors, and supplier quality/procurement teams to ensure material and process adherence, while developing techniques and quality screens to identify packaging reliability issues early.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related engineering field.
•2+ years of prior experience using engineering judgement and data analysis to draw conclusions, build models, and design experiments.
•Experience with materials science and engineering, including material characterization techniques.
•Experience with design of experiments, statistical data analysis, and statistical process control.
•Preferred: working knowledge or prior experience with optics and lasers, including laser micro-machining and micro-fabrication.

Experience:2+ years

Education:PhD / Doctorate in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering (or related engineering)

Skills:Problem-solvingEngineering judgmentStatistical analysis

Tech Stack:Design of experimentsStatistical data analysisStatistical process controlOpticsLasersLaser micro-machiningMicro-fabrication

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor