Senior Integrated Circuit Wafer Probe Hardware Design & Validation Engineer (Probe Specialist)

Broadcom
San Jose
Workplace: OnsiteFull timeUSD 143,800 - 230,000 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 12+ yearsSkills: ["Subject matter expertise","Cross-functional collaboration","Root cause analysis","Vendor management","Problem solving"]

Design and validate next-generation wafer probe architectures for high-power, full-reticle (2.5D/3D) silicon. Own the lifecycle from electric/thermal/mechanical modeling through probe hardware design, supplier oversight, technology proof, and production issue debugging. Lead SI/PI and mechanical contact analysis, deploy advanced probes (vertical, MEMS, direct dock, micro-bump, sacrificial pad), run lab measurements (VNAs/TDR), and drive failure analysis with cross-functional teams and external vendors.

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FursaFursa
Broadcom
Broadcom
1 month ago

Senior Integrated Circuit Wafer Probe Hardware Design & Validation Engineer (Probe Specialist)

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 26 days agoStatus: Live

Job Summary

Design and validate next-generation wafer probe architectures for high-power, full-reticle (2.5D/3D) silicon. Own the lifecycle from electric/thermal/mechanical modeling through probe hardware design, supplier oversight, technology proof, and production issue debugging. Lead SI/PI and mechanical contact analysis, deploy advanced probes (vertical, MEMS, direct dock, micro-bump, sacrificial pad), run lab measurements (VNAs/TDR), and drive failure analysis with cross-functional teams and external vendors.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Own the full lifecycle of custom probe architectures, from electric/thermal/mechanical modeling through probe hardware design, supplier oversight, technology proof, and production issue debug.
  • •Lead mechanical and electrical architecture for advanced probe cards, including vertical probe, MEMS probe, direct dock, probe on micro-bump/sacrificial pad, space transformer, and probe card PCB design.
  • •Perform SI and PI analysis (impedance/crosstalk control, frequency domain PDN for power plane/decoupling) and mechanical contact force, alignment/planarity, and thermal warpage evaluation.
  • •Architect and evaluate probe solutions for wafer probes, 3D IC subassembly probing, and singulated die probing; analyze performance (C_res, CCC, mark size, touchdown life) and warpage.
  • •Execute lab quantification using advanced equipment and drive failure analysis (probe wear/burn, planarity, optical alignment) with corrective design actions, partnering with external probe/probe card vendors and collaborating with test/product/IC design teams.

Pay and Benefits

Salary: USD 143,800 - 230,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kEsppPaid LeaveEap

Key Requirements

  • •Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, or related fields.
  • •12+ years of hands-on experience focused on probe card design, vertical/MEMS probes, or high-performance test fixture development.
  • •Strong hands-on experience using Vector Network Analyzers (VNAs), Time-Domain Reflectometry (TDR), and scopes to analyze SI and PI performance.
  • •Deep understanding of transmission line theory, RF/microwave principles, and SI/PI fundamentals.
  • •High proficiency with 3D CAD software (SolidWorks, Autodesk Inventor, or Creo) and FEA modeling techniques.
Experience:12+ yearsSemiconductorsHigh-performance testingAI hardware
Education:
Skills:Subject matter expertiseCross-functional collaborationRoot cause analysisVendor managementProblem solving
Tech Stack:Vector Network Analyzer (VNA)Time-Domain Reflectometry (TDR)SolidWorksAutodesk InventorCreoFEAPythonMATLABAdvantestTeradyneScopesMicroscopesWafer probers

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn