Broadcom

2 days ago

Senior Integrated Circuit Wafer Probe Hardware Design & Validation Engineer (Probe Specialist)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 21 hours agoStatus: Live

Job Summary

Design and validate next-generation wafer probe architectures for high-power, full-reticle (2.5D/3D) silicon. Own the lifecycle from electric/thermal/mechanical modeling through probe hardware design, supplier oversight, technology proof, and production issue debugging. Lead SI/PI and mechanical contact analysis, deploy advanced probes (vertical, MEMS, direct dock, micro-bump, sacrificial pad), run lab measurements (VNAs/TDR), and drive failure analysis with cross-functional teams and external vendors.

Location: San Jose

Workplace: Onsite

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Seniority: Mid level

Key Responsibilities

•Own the full lifecycle of custom probe architectures, from electric/thermal/mechanical modeling through probe hardware design, supplier oversight, technology proof, and production issue debug.
•Lead mechanical and electrical architecture for advanced probe cards, including vertical probe, MEMS probe, direct dock, probe on micro-bump/sacrificial pad, space transformer, and probe card PCB design.
•Perform SI and PI analysis (impedance/crosstalk control, frequency domain PDN for power plane/decoupling) and mechanical contact force, alignment/planarity, and thermal warpage evaluation.
•Architect and evaluate probe solutions for wafer probes, 3D IC subassembly probing, and singulated die probing; analyze performance (C_res, CCC, mark size, touchdown life) and warpage.
•Execute lab quantification using advanced equipment and drive failure analysis (probe wear/burn, planarity, optical alignment) with corrective design actions, partnering with external probe/probe card vendors and collaborating with test/product/IC design teams.

Pay and Benefits

Salary: USD 143,800 - 230,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEsppPaid LeaveEap

Key Requirements

•Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, or related fields.
•12+ years of hands-on experience focused on probe card design, vertical/MEMS probes, or high-performance test fixture development.
•Strong hands-on experience using Vector Network Analyzers (VNAs), Time-Domain Reflectometry (TDR), and scopes to analyze SI and PI performance.
•Deep understanding of transmission line theory, RF/microwave principles, and SI/PI fundamentals.
•High proficiency with 3D CAD software (SolidWorks, Autodesk Inventor, or Creo) and FEA modeling techniques.

Experience:12+ yearsSemiconductorsHigh-performance testingAI hardware

Education:

Skills:Subject matter expertiseCross-functional collaborationRoot cause analysisVendor managementProblem solving

Tech Stack:Vector Network Analyzer (VNA)Time-Domain Reflectometry (TDR)SolidWorksAutodesk InventorCreoFEAPythonMATLABAdvantestTeradyneScopesMicroscopesWafer probers

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

2 days ago

Senior Integrated Circuit Wafer Probe Hardware Design & Validation Engineer (Probe Specialist)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 21 hours agoStatus: Live

Job Summary

Location: San Jose

Workplace: Onsite

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Seniority: Mid level

Key Responsibilities

•Own the full lifecycle of custom probe architectures, from electric/thermal/mechanical modeling through probe hardware design, supplier oversight, technology proof, and production issue debug.
•Lead mechanical and electrical architecture for advanced probe cards, including vertical probe, MEMS probe, direct dock, probe on micro-bump/sacrificial pad, space transformer, and probe card PCB design.
•Perform SI and PI analysis (impedance/crosstalk control, frequency domain PDN for power plane/decoupling) and mechanical contact force, alignment/planarity, and thermal warpage evaluation.
•Architect and evaluate probe solutions for wafer probes, 3D IC subassembly probing, and singulated die probing; analyze performance (C_res, CCC, mark size, touchdown life) and warpage.
•Execute lab quantification using advanced equipment and drive failure analysis (probe wear/burn, planarity, optical alignment) with corrective design actions, partnering with external probe/probe card vendors and collaborating with test/product/IC design teams.

Pay and Benefits

Salary: USD 143,800 - 230,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEsppPaid LeaveEap

Key Requirements

•Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, or related fields.
•12+ years of hands-on experience focused on probe card design, vertical/MEMS probes, or high-performance test fixture development.
•Strong hands-on experience using Vector Network Analyzers (VNAs), Time-Domain Reflectometry (TDR), and scopes to analyze SI and PI performance.
•Deep understanding of transmission line theory, RF/microwave principles, and SI/PI fundamentals.
•High proficiency with 3D CAD software (SolidWorks, Autodesk Inventor, or Creo) and FEA modeling techniques.

Experience:12+ yearsSemiconductorsHigh-performance testingAI hardware

Education:

Skills:Subject matter expertiseCross-functional collaborationRoot cause analysisVendor managementProblem solving

Tech Stack:Vector Network Analyzer (VNA)Time-Domain Reflectometry (TDR)SolidWorksAutodesk InventorCreoFEAPythonMATLABAdvantestTeradyneScopesMicroscopesWafer probers

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn