RF Engineer II (R6053)

Shield AI
Seattle
Workplace: OnsiteFull timeUSD 110,000 - 170,000 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 1+ yearsEducation: bachelorsSkills: ["Cross-functional communication","Technical documentation","Problem diagnosis"]

Design and deliver compact, high-performance RF and microwave hardware modules for airborne and ground systems. You’ll create active and passive RF circuits, PCB assemblies, and packaging interfaces, then perform simulation, laboratory characterization, verification, and production release. Working with cross-functional engineering, you’ll develop repeatable verification and test strategies while ensuring performance across gain, noise figure, power, linearity, stability, and EMC/EMI constraints.

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FursaFursa
Shield AI
Shield AI
14 hours ago

RF Engineer II (R6053)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live

Job Summary

Design and deliver compact, high-performance RF and microwave hardware modules for airborne and ground systems. You’ll create active and passive RF circuits, PCB assemblies, and packaging interfaces, then perform simulation, laboratory characterization, verification, and production release. Working with cross-functional engineering, you’ll develop repeatable verification and test strategies while ensuring performance across gain, noise figure, power, linearity, stability, and EMC/EMI constraints.
Location: Seattle
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Design RF and microwave modules from requirements through schematic capture, component selection, layout, bring-up, verification, qualification, and production release.
  • •Develop active and passive RF circuits (e.g., LNAs, power amplifiers, filters/multiplexers, RF switches/limiters, couplers/attenuators, power detectors, and frequency conversion stages).
  • •Perform circuit and electromagnetic analysis and correlate models with measured hardware performance.
  • •Create and review RF and mixed-signal PCB designs, including controlled-impedance routing, grounding/shielding, stack-up definition, power distribution, and component placement.
  • •Plan and execute laboratory characterization, diagnose complex hardware issues, and support environmental/electromagnetic qualification and integration.

Pay and Benefits

Salary: USD 110,000 - 170,000 annually
Equity and Bonus:Equity

Key Requirements

  • •Bachelor’s degree in Electrical Engineering, Applied Physics, or a related field, or equivalent practical experience.
  • •Typically 1+ years of relevant post-undergraduate experience for L2, or 2+ years for L3.
  • •Hands-on experience designing, building, or debugging RF/microwave circuits, modules, or PCB assemblies through measured verification.
  • •Solid understanding of S-parameters, impedance matching, transmission lines, stability, gain/noise figure, linearity/compression, and cascaded RF performance.
  • •Ability to work on-site in a laboratory and hardware-development environment.
Experience:1+ years
Education:Bachelor's in Electrical Engineering, Applied Physics
Skills:Cross-functional communicationTechnical documentationProblem diagnosis
Tech Stack:Keysight ADSCadence AWRHFSSCSTAltium DesignerPythonMATLAB

Eligibility

Security Clearance:S//SAR

Company Brief

Shield AI
Develops AI-powered autonomy and software for military aircraft and drones to enable autonomous ISR and combat missions, integrating perception, navigation, and mission planning for defense customers.
Industry: Defense Technology
Company Size: Large (251 to 1,000 employees)
Growth: Scaleup
Funding: Series E+
Headquarters: San Diego, United States
Founded: 2015
WebsiteLinkedIn