IC Package Layout Team Leader

Cisco
San Jose
Workplace: HybridFull timeUSD 210,600 - 305,100 annuallyFunction: Administration & Executive AssistanceExperience: 5+ yearsSkills: ["Mentorship","People leadership","Technical guidance","Collaboration","Continuous improvement"]

Lead and grow the San Jose package layout team, providing technical guidance, mentorship, and day-to-day support for advanced ASIC packaging projects. Partner with package leads, SI/PI teams, and manufacturing to resolve technical and process challenges, improve methodologies and flows, and drive high-quality package implementations. Manage priorities and resource allocation across multiple concurrent programs, optimize pinouts, stack-ups, power distribution, and high-speed routing, and contribute to hiring and continuous improvement.

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FursaFursa
Cisco
Cisco
1 month ago

IC Package Layout Team Leader

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Lead and grow the San Jose package layout team, providing technical guidance, mentorship, and day-to-day support for advanced ASIC packaging projects. Partner with package leads, SI/PI teams, and manufacturing to resolve technical and process challenges, improve methodologies and flows, and drive high-quality package implementations. Manage priorities and resource allocation across multiple concurrent programs, optimize pinouts, stack-ups, power distribution, and high-speed routing, and contribute to hiring and continuous improvement.
Location: San Jose
Workplace: Hybrid
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Manager level

Key Responsibilities

  • •Lead and support the San Jose package layout team with technical guidance, mentorship, and day-to-day support.
  • •Execute package layout activities for complex ASIC packaging projects, ensuring quality alignment with package design, SI/PI, and manufacturing requirements.
  • •Collaborate with package leads, SI/PI teams, silicon floor planning, and manufacturing partners to resolve technical and process challenges.
  • •Coordinate package layout resource allocation, priorities, and staffing across multiple concurrent projects.
  • •Optimize package pinouts, stack-ups, power distribution, escape routing, and high-speed interface implementation while driving continuous improvement.

Pay and Benefits

Salary: USD 210,600 - 305,100 annually
Perks:Health InsuranceDentalVision401kPaid ParentalDisability CoverageLife InsuranceEquityAnnual BonusPaid Leave

Key Requirements

  • •Bachelor’s in Electrical Engineering (or related) with 12+ years, or Master’s with 8+ years, or PhD with 5+ years experience.
  • •5+ years’ experience in package layout or advanced PCB/package implementation.
  • •Experience with high-speed routing, power distribution networks (PDN), and package layout design principles.
  • •Experience using industry-standard EDA tools for package layout and design.
  • •Proficiency with Cadence APD+ (or equivalent) and/or experience with SI/PI considerations is preferred.
Experience:5+ yearsASIC packagingAdvanced PCB
Education:
Skills:MentorshipPeople leadershipTechnical guidanceCollaborationContinuous improvement
Tech Stack:Cadence APD+PythonPerlTCLEDA toolsHigh-speed routingPower distribution networks (PDN)

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
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