Intel

2 weeks ago

Advanced Packaging Process Integration Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 13 hours agoStatus: Live

Job Summary

Own process integration and yield improvement for Intel’s advanced packaging and backend assembly-test workflows, from NPI through high-volume manufacturing ramp. Define process flows and equipment configurations for technology transfer, analyze structured/unstructured data using statistics and ML with SQL and Python, and lead initiatives to resolve low-yield issues and prevent quality excursions. Perform reliability risk assessments and mentor technical talent within the Foundry Technology Manufacturing team.

Location: Albuquerque

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Define and establish process flows, procedures, and equipment configurations for successful technology transfer.
•Analyze structured and unstructured data to extract insights using statistical/ML methods and coding tools such as SQL and Python.
•Drive yield improvement by identifying and resolving low-yield issues in coordination with internal and external stakeholders.
•Implement continuous improvement programs to prevent quality, line yield, and sort yield excursions.
•Perform quality and reliability risk assessments for manufacturing materials and process changes.

Pay and Benefits

Salary: USD 120,860 - 170,630 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Bachelor’s degree in Engineering, Material Science, Physics, or related field with 4+ years relevant experience, or Master’s with 3+ years, or PhD with no experience.
•Experience with process integration, yield analysis, and quality management in TD or high-volume manufacturing environments.
•Experience with semiconductor advanced packaging and backend assembly-test process development.
•Use data analysis tools and coding such as SQL and Python, including statistical/ML methods.
•Strong ability to lead cross-functional problem-solving and collaborate effectively with stakeholders.

Experience:4+ yearsSemiconductorAdvanced packagingHigh-volume manufacturingProcess integration

Education:Bachelor's

Skills:Cross-functional collaborationProblem-solvingCommunicationMentoringInnovation

Tech Stack:SQLPythonMachine learningStatistical methods

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

2 weeks ago

Advanced Packaging Process Integration Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 13 hours agoStatus: Live

Job Summary

Location: Albuquerque

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Define and establish process flows, procedures, and equipment configurations for successful technology transfer.
•Analyze structured and unstructured data to extract insights using statistical/ML methods and coding tools such as SQL and Python.
•Drive yield improvement by identifying and resolving low-yield issues in coordination with internal and external stakeholders.
•Implement continuous improvement programs to prevent quality, line yield, and sort yield excursions.
•Perform quality and reliability risk assessments for manufacturing materials and process changes.

Pay and Benefits

Salary: USD 120,860 - 170,630 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Bachelor’s degree in Engineering, Material Science, Physics, or related field with 4+ years relevant experience, or Master’s with 3+ years, or PhD with no experience.
•Experience with process integration, yield analysis, and quality management in TD or high-volume manufacturing environments.
•Experience with semiconductor advanced packaging and backend assembly-test process development.
•Use data analysis tools and coding such as SQL and Python, including statistical/ML methods.
•Strong ability to lead cross-functional problem-solving and collaborate effectively with stakeholders.

Experience:4+ yearsSemiconductorAdvanced packagingHigh-volume manufacturingProcess integration

Education:Bachelor's

Skills:Cross-functional collaborationProblem-solvingCommunicationMentoringInnovation

Tech Stack:SQLPythonMachine learningStatistical methods

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor