Mechanical and Thermal Analysis of Advanced Packaged Devices Intern
AMD
Singapore
Workplace: OnsiteInternshipFunction: Field Service, Maintenance & Skilled TradesEducation: mastersSkills: ["Communication","Teamwork","Presentation","Analytical thinking","Problem-solving"]Internship focused on designing and executing mechanical and thermal analyses for advanced semiconductor packages, using MATLAB and Python to analyze data, collaborating across functional teams in a high-tech R&D environment, with exposure to packaging reliability and performance discussions.

