New College Grad - Product Yield Enhancement Engineer, HBM

Micron Technology
Boise, Idaho
Workplace: OnsiteFull timeFunction: Communications, PR & Community0Education: high_schoolSkills: ["Cross-functional collaboration","Technical communication","Root-cause analysis"]

Join the HBM team to improve product reliability and accelerate production ramp by performing failure analysis across production test, internal qualification, and customer returns. You’ll use electrical and physical failure analysis (including emission microscopy, laser-based methods, and EOTPR) plus data-driven modeling to isolate defects and identify root causes in fabrication and assembly processes. Collaborate with Product, Process, Assembly, Quality, and Management teams, and use AI-assisted tools to speed up root-cause determination.

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Micron Technology
Micron Technology
1 month ago

New College Grad - Product Yield Enhancement Engineer, HBM

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Join the HBM team to improve product reliability and accelerate production ramp by performing failure analysis across production test, internal qualification, and customer returns. You’ll use electrical and physical failure analysis (including emission microscopy, laser-based methods, and EOTPR) plus data-driven modeling to isolate defects and identify root causes in fabrication and assembly processes. Collaborate with Product, Process, Assembly, Quality, and Management teams, and use AI-assisted tools to speed up root-cause determination.
Location: Boise, Idaho
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Graduate level

Key Responsibilities

  • •Perform electrical failure analysis and fault isolation using emission microscopy, laser-based methods, and EOTPR.
  • •Analyze and model failure signatures from backend testing, qualification, and RMA data to identify root causes.
  • •Apply physical failure analysis (PFA) and de-processing techniques to isolate defects.
  • •Develop and maintain technical knowledge of CMOS/FinFET fabrication processes, device structures, and process integration.
  • •Generate failure analysis reports with root cause and corrective action insights and collaborate with cross-functional teams to drive resolution.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Computer Engineering, Physics, Chemistry, or equivalent practical experience.
  • •0–2 years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis.
  • •Experience with computer-aided design (CAD), including layout and schematic analysis.
  • •Strong understanding of semiconductor device physics and VLSI design principles.
  • •Proficiency in scripting within UNIX/Linux environments (e.g., Tcl, Bash, Shell).
Experience:0SemiconductorYield engineeringFault isolationFailure analysis
Education:High School in Electrical Engineering, Materials Science, Computer Engineering, Physics, Chemistry
Skills:Cross-functional collaborationTechnical communicationRoot-cause analysis
Tech Stack:High Bandwidth Memory (HBM)HBMEmission microscopyLaser-based methodsEOTPRComputer-aided design (CAD)UNIXLinuxTclBashShellAI-assisted analyticsData analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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