Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceEducation: mastersSkills: ["Problem-solving","Root cause analysis","Attention to detail","Teamwork","Communication"]

Develop reliability stress test flows, plans, and qualification execution for product reliability in high bandwidth memory (HBM). Partner with global Quality teams to manage qualification gating, root-cause failures using EFA and PFA, and drive improvements in extrinsic and intrinsic reliability metrics. Recommend process conversions with fab teams to reduce cost and increase yield, while using AI/ML and tools like Python and JMP to enhance reliability workflows and segmentation of failures.

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FursaFursa
Micron Technology
Micron Technology
19 hours ago

Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

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Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Develop reliability stress test flows, plans, and qualification execution for product reliability in high bandwidth memory (HBM). Partner with global Quality teams to manage qualification gating, root-cause failures using EFA and PFA, and drive improvements in extrinsic and intrinsic reliability metrics. Recommend process conversions with fab teams to reduce cost and increase yield, while using AI/ML and tools like Python and JMP to enhance reliability workflows and segmentation of failures.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Entry level

Key Responsibilities

  • •Define and develop reliability stress test flows, test plans, and coverage for product reliability aspects.
  • •Coordinate qualification planning and execution progress with the Global Quality team, and drive qualification gating issue resolution.
  • •Drive DPM reduction for extrinsic and intrinsic reliability using optimized manufacturing test flows and test strategy to meet quality, cost, and cycle time KPIs.
  • •Debug and identify root causes of qualification and RMA device issues using electric failure analysis (EFA) and physical failure analysis (PFA).
  • •Recommend fab process conversions and manage risks with Product Managers/Leads to improve cost, yields, and HBM reliability outcomes.

Pay and Benefits

Perks:Paid LeaveHealth InsuranceWellness StipendLearning BudgetEquity

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
  • •Experience in semiconductor devices, circuit design, or product validation.
  • •Solid problem-solving with a focus on identifying root causes and exploring solution spaces.
  • •Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • •Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
Experience:SemiconductorsProduct validationCircuit designHBMReliability testing
Education:Master's in Electrical and Electronics Engineering
Skills:Problem-solvingRoot cause analysisAttention to detailTeamworkCommunication
Tech Stack:PythonJMPClaude codeAgentic AIAI platformsAutomationRegressionClassificationAnomaly detectionClusteringEFAPFACMOSDRAM architectureHBMMachine learning

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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