Packaging Engineer, Substrate

AMD
Taiwan
Workplace: OnsiteFull timeTWD 1,691,060 - 2,415,800 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: mastersSkills: ["Communication","Project management","Data analysis","Teamwork","Time management"]

Ensure stable supply of IC substrates by managing substrate suppliers from NPI qualification through production release. Oversee NPI/LVM/HVM yield monitoring and drive HVM yield attainment using data analytics, corrective actions, and knowledge-sharing. Lead continuous improvement projects and quarterly technical reviews to improve supplier performance, quality, and cross-supplier outcomes for substrate manufacturing processes.

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FursaFursa
AMD
AMD
1 day ago

Packaging Engineer, Substrate

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Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live

Job Summary

Ensure stable supply of IC substrates by managing substrate suppliers from NPI qualification through production release. Oversee NPI/LVM/HVM yield monitoring and drive HVM yield attainment using data analytics, corrective actions, and knowledge-sharing. Lead continuous improvement projects and quarterly technical reviews to improve supplier performance, quality, and cross-supplier outcomes for substrate manufacturing processes.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Manage substrate suppliers from NPI bring-up/qualification to production release.
  • •Support new production site bring-up and qualification for substrate suppliers.
  • •Oversee NPI/LVM/HVM yield monitoring, sustaining, and improvements.
  • •Drive HVM yield attainment and resolve/prevent sustaining issues using data analytics and corrective actions.
  • •Lead continuous improvement projects, knowledge-sharing initiatives, and quarterly technical reviews using supplier scorecards.

Pay and Benefits

Salary: TWD 1,691,060 - 2,415,800 annually

Key Requirements

  • •Experience in IC substrate industries.
  • •Technical expertise in FC-BGA and LGA substrate manufacturing, assembly, and test processes.
  • •Strong statistical knowledge (DOE, SPC, 6 Sigma) and data analysis skills for technical work and reporting.
  • •Experience in substrate development from NPI through HVM.
  • •Proficiency in English (speaking, writing, and presenting).
Experience:IC substrates
Education:Master's in Mechanical or Material or Chemical Engineering
Skills:CommunicationProject managementData analysisTeamworkTime management
Languages:English
Tech Stack:DOESPC6 SigmaFC-BGALGA

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
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Glassdoor: 3.9
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