Senior Engineer, HIG HBM Package PE

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 8+ yearsEducation: mastersSkills: ["Leadership","Mentorship","Collaboration","Accountability","Innovation"]

Lead and develop a high-performing global team within the HIG HBM Systems and Product Engineering organization. Drive HBM Package PE activities focused on Quality, Cost, Cycle Time, and Scale by improving assembly coverage, reducing yield loss, and owning cumulative yield with cross-functional partners. Partner with FAB, Technology Development, Packaging, and Reliability teams using data analysis (including AI/ML) to prevent inline fallout, resolve packaging issues, and guide process conversions while mentoring others.

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FursaFursa
Micron Technology
Micron Technology
3 weeks ago

Senior Engineer, HIG HBM Package PE

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Lead and develop a high-performing global team within the HIG HBM Systems and Product Engineering organization. Drive HBM Package PE activities focused on Quality, Cost, Cycle Time, and Scale by improving assembly coverage, reducing yield loss, and owning cumulative yield with cross-functional partners. Partner with FAB, Technology Development, Packaging, and Reliability teams using data analysis (including AI/ML) to prevent inline fallout, resolve packaging issues, and guide process conversions while mentoring others.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Manager level

Key Responsibilities

  • •Lead and develop a global team to drive HIG HBM Package PE activities aligned to Quality, Cost, Cycle Time, and Scale KPIs.
  • •Improve assembly coverage to raise Time 0 and Field DPM and reduce/prevent inline fallout.
  • •Drive down HBM cube on wafer assembly yield loss using optimized test coverage and collaboration with Technology Development and Packaging teams.
  • •Own and improve cumulative yield and quality with cross-functional initiatives; handle Qual/Package and RMA packaging-related issues.
  • •Analyze yield and reliability data (including AI/ML) to create alerts for yield loss and trends, and lead front-end/back-end process conversions for yield and DPM improvement.

Key Requirements

  • •Bachelors/Masters degree in Electrical Engineering.
  • •8+ years of experience in the semiconductor industry.
  • •Strong leadership and ability to lead both teams and technical programs in a dynamic environment.
  • •Proven track record collaborating across teams to solve complex business and engineering problems.
  • •Professional experience in Micron Product Engineering and Packaging is preferred.
Experience:8+ yearsSemiconductor industryMicronProduct engineeringPackaging
Education:Master's in Electrical Engineering
Skills:LeadershipMentorshipCollaborationAccountabilityInnovation
Tech Stack:CMOSMachine learningAIStatistical toolsAgentic AI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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