Packaging Module Equipment Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 99,030 - 188,890 annuallyFunction: Design (Product/UX/UI/Visual)Experience: 2+ yearsEducation: bachelorsSkills: ["Problem-solving","Continuous improvement","Technical innovation","Project management"]

Develop and optimize assembly packaging processes and equipment for Intel’s next-generation packaging technologies. You’ll apply Design of Experiments (DOE) and statistical methods to improve equipment capabilities and process specifications, document findings, and support manufacturability from development through high-volume manufacturing. The role also involves troubleshooting and reliability issue identification, integrating new materials/architectures into equipment, and standardizing equipment qualification and manufacturing quality systems to meet cost, yield, productivity, and reliability goals.

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FursaFursa
Intel
Intel
5 days ago

Packaging Module Equipment Development Engineer

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live
Reposted: similar role first listed 6 months ago

Job Summary

Develop and optimize assembly packaging processes and equipment for Intel’s next-generation packaging technologies. You’ll apply Design of Experiments (DOE) and statistical methods to improve equipment capabilities and process specifications, document findings, and support manufacturability from development through high-volume manufacturing. The role also involves troubleshooting and reliability issue identification, integrating new materials/architectures into equipment, and standardizing equipment qualification and manufacturing quality systems to meet cost, yield, productivity, and reliability goals.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
  • •Apply DOE and statistical methods to refine process specifications and document findings in technical reports.
  • •Ensure manufacturability of physical layouts in package designs and manage equipment health and long-term reliability from development through high-volume manufacturing.
  • •Integrate new materials and architectures into equipment to support advanced foundry customer product manufacturability.
  • •Innovate techniques and quality screens to proactively identify and address equipment health and reliability issues, leading continuous improvement efforts.

Pay and Benefits

Salary: USD 99,030 - 188,890 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •US Citizenship.
  • •Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience, or a Master’s (1+), or PhD in a related field.
  • •Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • •Ability to lead technical innovation and manage complex, time-sensitive projects.
  • •Experience with high-volume manufacturing, equipment troubleshooting, and change qualification (preferred).
Experience:2+ yearsHigh-volume manufacturingSemiconductor packaging
Education:Bachelor's in Mechanical Engineering, Materials Science, Metallurgical Engineering (or related STEM)
Skills:Problem-solvingContinuous improvementTechnical innovationProject management
Tech Stack:SPCDesign of Experiments (DOE)Statistical process controlTechnical reports

Eligibility

Nationality:US National

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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