AMD

3 days ago

Staff Process Technology Integration Engineer

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Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Interface with HBM (high bandwidth memory) and foundry teams in AMD’s Process Technology Integration group to resolve silicon manufacturing issues affecting yield, reliability, and performance. Drive process improvement evaluations (CIP/BKM), review defect and parametric signatures, and perform hands-on yield and test-data analysis across HBM/DRAM and logic flows. Collaborate with device analysis, supplier quality, and reliability teams to identify root causes and corrective actions across FEOL/MEOL/BEOL modules.

Location: Singapore

Workplace: Hybrid

Employment Type: Full time

Job Function: Communications, PR & Community

Key Responsibilities

•Interface with HBM vendor and wafer foundry teams to resolve manufacturing issues affecting yield, reliability, and performance.
•Provide process and integration expertise for advanced Front/Middle/Back End Of line (F/M/BEOL) modules across HBM/DRAM and logic process flows.
•Review systematic defect and parametric signatures and oversee F/M/BEOL issues across products and technology nodes.
•Design and analyze process improvement (CIP/BKM) evaluations and provide technical assessment for AMD process change review board decisions.
•Conduct hands-on yield and test-parameter analysis (hardbin/softbin, parametric data, WAT/electrical test) and collaborate with device analysis and supplier quality/reliability teams on root cause and corrective actions.

Pay and Benefits

Salary: SGD 92,400 - 132,000 annually

Key Requirements

•Professional experience in the semiconductor industry across multiple technology nodes/generations.
•Experience with advanced semiconductor technologies for HBM/DRAM fabrication or FinFET technology nodes, including understanding basic process flows for both.
•Hands-on experience in unit process modules and/or process integration across FEOL (isolation, gate stack, patterning, epi), MEOL (replacement gate, contact), and/or BEOL (interconnect).
•Knowledge of PFA and FI techniques used in device analysis, including deducing failure mechanisms and process steps.
•Strong communication skills to interact with and influence external vendors/foundries and internal teams in a globally distributed environment.

Experience:Semiconductor industryHBMDRAMWafer fabricationFinFETAI products

Education:Bachelor's in Electrical Engineering, Chemical Engineering, Materials Science and Engineering, Physics, or Chemistry

Skills:CommunicationStakeholder managementProcess integration thinkingAnalytical reasoning

Languages:En-us

Tech Stack:HBMHigh Bandwidth MemoryDRAMSilicon manufacturingYield analysisReliabilityHBM/DRAMFinFETFEOLMEOLBEOLCIP/BKMDefect signaturesParametric signaturesHardbinSoftbinWATElectrical testPFAFI

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD