Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3+ yearsSkills: ["Problem-solving","Root cause analysis","Collaboration","Communication","People leadership"]

Own assembly and HBM cube yield improvement for next-generation HBM products by driving Time 0/Field DPM performance, optimizing test flows, and reducing inline fallout. Lead cumulative yield and quality initiatives, debug and resolve qualification/RMA packaging issues using EFA and PFA, and collaborate across Fab, design, technology development, and quality/reliability teams. Apply statistics, data analysis, and AI/ML models to improve key KPIs (quality, cost, cycle time, scale).

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FursaFursa
Micron Technology
Micron Technology
4 days ago

Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live
Reposted: similar role first listed 3 months ago

Job Summary

Own assembly and HBM cube yield improvement for next-generation HBM products by driving Time 0/Field DPM performance, optimizing test flows, and reducing inline fallout. Lead cumulative yield and quality initiatives, debug and resolve qualification/RMA packaging issues using EFA and PFA, and collaborate across Fab, design, technology development, and quality/reliability teams. Apply statistics, data analysis, and AI/ML models to improve key KPIs (quality, cost, cycle time, scale).
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Improve assembly related coverage to raise Time 0 and Field DPM performance and reduce/prevent inline fallout.
  • •Improve HBM cube yield via test optimization and coverage collaboration with technology development and packaging organizations.
  • •Lead cumulative yield and quality improvement initiatives with cross-functional teams.
  • •Debug and identify root causes and failures in qualification and RMA packaging using EFA and PFA, driving cross-functional resolution and improvements.
  • •Collaborate with teams across Fab, HBM technology/design, system development, and quality/reliability to support successful shipping; advocate AI/ML models to enhance KPIs (quality, cost, cycle time, scale).

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth InsuranceRecognition

Key Requirements

  • •Bachelors/Masters degree in Electrical/Electronic/Mechanical Engineering.
  • •3+ years of experience in the semiconductor industry.
  • •Product engineering and packaging experience is preferred.
  • •Demonstrated technical problem-solving skills with root-cause understanding and in-depth circuit analysis.
  • •Good knowledge of statistics and data analysis tools and scripting, plus experience in test flows and assembly process/advanced packaging.
Experience:3+ yearsSemiconductor
Education:
Skills:Problem-solvingRoot cause analysisCollaborationCommunicationPeople leadership
Tech Stack:AI/MLMachine learningStatisticsData analysisScriptingTest optimizationElectric failure analysis (EFA)Physical failure analysis (PFA)

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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